Assignee
VINCENT MICHAEL B
US·13 granted patents·1 pending application·84 citations·filing 2012–2015
Top patents by PatentIndex Score
14 records- 0193US9826630B2Fan-out wafer level packages having preformed embedded ground plane connections and methods for the fabrication thereofVINCENT MICHAEL B·Filed 2014·Granted Nov 21, 2017·15 cites·14 claims
- 0292US9595485B2Microelectronic packages having embedded sidewall substrates and methods for the producing thereofVINCENT MICHAEL B·Filed 2014·Granted Mar 14, 2017·11 cites·17 claims
- 0392US9111870B2Microelectronic packages containing stacked microelectronic devices and methods for the fabrication thereofVINCENT MICHAEL B·Filed 2013·Granted Aug 18, 2015·13 cites·20 claims
- 0491US9355985B2Microelectronic packages having sidewall-deposited heat spreader structures and methods for the fabrication thereofVINCENT MICHAEL B·Filed 2014·Granted May 31, 2016·12 cites·20 claims
- 0589US9331029B2Microelectronic packages having mold-embedded traces and methods for the production thereofVINCENT MICHAEL B·Filed 2014·Granted May 3, 2016·11 cites·20 claims
- 0684US9036363B2Devices and stacked microelectronic packages with parallel conductors and intra-conductor isolator structures and methods of their fabricationVINCENT MICHAEL B·Filed 2013·Granted May 19, 2015·7 cites·17 claims
- 0783US9263420B2Devices and stacked microelectronic packages with package surface conductors and methods of their fabricationVINCENT MICHAEL B·Filed 2013·Granted Feb 16, 2016·5 cites·14 claims
- 0875US9502363B2Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layersVINCENT MICHAEL B·Filed 2014·Granted Nov 22, 2016·4 cites·16 claims
- 0974US9305911B2Devices and stacked microelectronic packages with package surface conductors and adjacent trenches and methods of their fabricationVINCENT MICHAEL B·Filed 2013·Granted Apr 5, 2016·3 cites·20 claims
- 1067US9520323B2Microelectronic packages having trench vias and methods for the manufacture thereofVINCENT MICHAEL B·Filed 2012·Granted Dec 13, 2016·2 cites·18 claims
- 1164US9257415B2Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereofVINCENT MICHAEL B·Filed 2015·Granted Feb 9, 2016·1 cites·20 claims
- 1248US10354958B2Through package circuit in fan-out wafer level packageVINCENT MICHAEL B·Filed 2014·Granted Jul 16, 2019·0 cites·20 claims
- 1345US2016013076A1Three dimensional package assemblies and methods for the production thereofVINCENT MICHAEL B·Filed 2014·Application pending·0 cites
- 1442US9245819B2Embedded electrical component surface interconnectVINCENT MICHAEL B·Filed 2012·Granted Jan 26, 2016·0 cites·15 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →