Assignee
VIASYSTEMS GROUP INC
US·16 granted patents·1 pending application·347 citations·filing 1999–2006
Top patents by PatentIndex Score
17 records- 0193US7316461B2Indoor-outdoor equipment enclosure and method for assembling the sameVIASYSTEMS GROUP INC·Filed 2006·Granted Jan 8, 2008·44 cites·2 claims
- 0287US7096555B2Closed loop backdrilling systemVIASYSTEMS GROUP INC·Filed 2004·Granted Aug 29, 2006·47 cites·27 claims
- 0386US7178994B2Fiber optic circuit connectorVIASYSTEMS GROUP INC·Filed 2005·Granted Feb 20, 2007·15 cites·5 claims
- 0486US6594435B2Bending an optical fiber into a backplaneVIASYSTEMS GROUP INC·Filed 2002·Granted Jul 15, 2003·22 cites·2 claims
- 0585US7086707B2Indoor-outdoor equipment enclosure and method for assembling the sameVIASYSTEMS GROUP INC·Filed 2003·Granted Aug 8, 2006·38 cites·2 claims
- 0680US6713685B1Non-circular micro-viaVIASYSTEMS GROUP INC·Filed 1999·Granted Mar 30, 2004·70 cites·5 claims
- 0778US6581202B1System and method for monitoring and improving dimensional stability and registration accuracy of multi-layer PCB manufactureVIASYSTEMS GROUP INC·Filed 2000·Granted Jun 17, 2003·20 cites·70 claims
- 0874US6782181B2Bending an optical fiber into backplaneVIASYSTEMS GROUP INC·Filed 2003·Granted Aug 24, 2004·10 cites·10 claims
- 0972US7364366B2Circuit board assembly having a guide insertVIASYSTEMS GROUP INC·Filed 2006·Granted Apr 29, 2008·6 cites·2 claims
- 1072US6834131B2System and method for integrating optical layers in a PCB for inter-board communicationsVIASYSTEMS GROUP INC·Filed 2002·Granted Dec 21, 2004·13 cites·9 claims
- 1169US6974036B2Corner post and manufacturing process for making sameVIASYSTEMS GROUP INC·Filed 2003·Granted Dec 13, 2005·16 cites·14 claims
- 1268US6818115B2System and method for electrolytic platingVIASYSTEMS GROUP INC·Filed 2002·Granted Nov 16, 2004·9 cites·18 claims
- 1367US6976793B2Fiber optic circuit connectorVIASYSTEMS GROUP INC·Filed 2004·Granted Dec 20, 2005·9 cites·15 claims
- 1465US7024086B2System and method for integrating optical layers in a PCB for inter-board communicationsVIASYSTEMS GROUP INC·Filed 2004·Granted Apr 4, 2006·8 cites·19 claims
- 1562US6848840B2Fiber optic circuit board connectorVIASYSTEMS GROUP INC·Filed 2001·Granted Feb 1, 2005·7 cites·2 claims
- 1661US6651324B1Process for manufacture of printed circuit boards with thick copper power circuitry and thin copper signal circuitry on the same layerVIASYSTEMS GROUP INC·Filed 2000·Granted Nov 25, 2003·13 cites·48 claims
- 1746US2008127484A1Selective filling of through holesVIASYSTEMS GROUP INC·Filed 2006·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →