Assignee
VEERARAGHAVAN THANIKAIVELAN TINDIVANAM
US·8 granted patents·6 pending applications·11 citations·filing 2018–2025
Top patents by PatentIndex Score
14 records- 0192US11905384B2Epoxy based reinforcing patches having improved damping loss factorVEERARAGHAVAN THANIKAIVELAN TINDIVANAM·Filed 2023·Granted Feb 20, 2024·2 cites·9 claims
- 0292US11591447B2Epoxy based reinforcing patches having improved damping loss factorVEERARAGHAVAN THANIKAIVELAN TINDIVANAM·Filed 2022·Granted Feb 28, 2023·3 cites·14 claims
- 0391US11339262B2Epoxy based reinforcing patches having improved damping loss factorVEERARAGHAVAN THANIKAIVELAN TINDIVANAM·Filed 2018·Granted May 24, 2022·6 cites·11 claims
- 0487US12291619B2Epoxy based reinforcing patches having improved damping loss factorVEERARAGHAVAN THANIKAIVELAN TINDIVANAM·Filed 2024·Granted May 6, 2025·0 cites·15 claims
- 0582US2025051620A1Electromagnetic curable novel toughened epoxy-hybrid structural adhesives and applications using the sameVEERARAGHAVAN THANIKAIVELAN TINDIVANAM·Filed 2024·Application pending·0 cites
- 0675US12415933B2Non-aqueous sprayable and curable dampening compositions for automotive body and closure panels and associated methods for curing and using the sameVEERARAGHAVAN THANIKAIVELAN TINDIVANAM·Filed 2023·Granted Sep 16, 2025·0 cites·25 claims
- 0772US12110425B2Electromagnetic curable novel toughened epoxy-hybrid structural adhesives and applications using the sameVEERARAGHAVAN THANIKAIVELAN TINDIVANAM·Filed 2021·Granted Oct 8, 2024·0 cites·2 claims
- 0870US2025297125A1Non-aqueous sprayable and curable dampening compositions for automotive body and closure panels and associated methods for curing and using the sameVEERARAGHAVAN THANIKAIVELAN TINDIVANAM·Filed 2025·Application pending·0 cites
- 0965US2025043163A1Energy saving, low temperature curable, pumpable, structural adhesive compositions for use in automotive body-in-white (biw) applicationsVEERARAGHAVAN THANIKAIVELAN TINDIVANAM·Filed 2023·Application pending·0 cites
- 1060US2025171654A1Storage stable, one-component, solvent-free, non-halogenated, heat curable compositions for use in encapsulation of electrical componentsVEERARAGHAVAN THANIKAIVELAN TINDIVANAM·Filed 2023·Application pending·0 cites
- 1159US12534611B2Energy saving, expandable, pumpable, anti-flutter compositions for use in automotive body-in-white (BIW) applicationsVEERARAGHAVAN THANIKAIVELAN TINDIVANAM·Filed 2022·Granted Jan 27, 2026·0 cites·2 claims
- 1258US2025101275A1Pumpable, one-component, high wash resistant, anti-flutter compositions for use in automotive applicationsVEERARAGHAVAN THANIKAIVELAN TINDIVANAM·Filed 2023·Application pending·0 cites
- 1352US2022041898A1Low modulus, high elongation structural adhesives and associated bonded substratesVEERARAGHAVAN THANIKAIVELAN TINDIVANAM·Filed 2020·Application pending·0 cites
- 1429US12540216B2Two-component moisture curable thermal interface material for thermal management systemsVEERARAGHAVAN THANIKAIVELAN TINDIVANAM·Filed 2021·Granted Feb 3, 2026·0 cites·3 claims
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