Assignee
VANNIER PATRICK
FR·3 granted patents·21 citations·filing 2011–2011
Technology mixH10W3
Top patents by PatentIndex Score
3 records- 0188US8765604B2Interconnection structure for an integrated circuitVANNIER PATRICK·Filed 2011·Granted Jul 1, 2014·19 cites·9 claims
- 0260US8461046B2Process for producing a metallization level and a via level and corresponding integrated circuitVANNIER PATRICK·Filed 2011·Granted Jun 11, 2013·2 cites·10 claims
- 0342US8492264B2Method for forming interconnection levels of an integrated circuitVANNIER PATRICK·Filed 2011·Granted Jul 23, 2013·0 cites·26 claims
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