Assignee
UTAC THAI LTD
TH·25 granted patents·1 pending application·99 citations·filing 2005–2016
Top patents by PatentIndex Score
26 records- 0194US7327017B2Semiconductor package including leadframe roughened with chemical etchant to prevent separation between leadframe and molding compoundUTAC THAI LTD·Filed 2005·Granted Feb 5, 2008·40 cites·22 claims
- 0288US7790512B1Molded leadframe substrate semiconductor packageUTAC THAI LTD·Filed 2008·Granted Sep 7, 2010·14 cites·21 claims
- 0385US8461694B1Lead frame ball grid array with traces under die having interlocking featuresUTAC THAI LTD·Filed 2012·Granted Jun 11, 2013·7 cites·13 claims
- 0485US8460970B1Lead frame ball grid array with traces under die having interlocking featuresUTAC THAI LTD·Filed 2012·Granted Jun 11, 2013·7 cites·7 claims
- 0580US8013437B1Package with heat transferUTAC THAI LTD·Filed 2007·Granted Sep 6, 2011·9 cites·20 claims
- 0679US8367476B2Metallic solderability preservation coating on metal part of semiconductor package to prevent oxideUTAC THAI LTD·Filed 2009·Granted Feb 5, 2013·11 cites·25 claims
- 0767US8704381B2Very extremely thin semiconductor packageUTAC THAI LTD·Filed 2013·Granted Apr 22, 2014·1 cites·12 claims
- 0866US7922877B2Method and apparatus for plating a semiconductor packageUTAC THAI LTD·Filed 2009·Granted Apr 12, 2011·0 cites·8 claims
- 0965US7572168B1Method and apparatus for high speed singulationUTAC THAI LTD·Filed 2007·Granted Aug 11, 2009·6 cites·37 claims
- 1062US8368189B2Auxiliary leadframe member for stabilizing the bond wire processUTAC THAI LTD·Filed 2010·Granted Feb 5, 2013·1 cites·17 claims
- 1161US7718522B2Method and apparatus for plating a semiconductor packageUTAC THAI LTD·Filed 2008·Granted May 18, 2010·0 cites·11 claims
- 1260US8652879B2Lead frame ball grid array with traces under dieUTAC THAI LTD·Filed 2013·Granted Feb 18, 2014·1 cites·18 claims
- 1358US9093486B2Molded leadframe substrate semiconductor packageUTAC THAI LTD·Filed 2013·Granted Jul 28, 2015·0 cites·5 claims
- 1456US9972563B2Plated terminals with routing interconnections semiconductor deviceUTAC THAI LTD·Filed 2016·Granted May 15, 2018·0 cites·20 claims
- 1556US9922913B2Plated terminals with routing interconnections semiconductor deviceUTAC THAI LTD·Filed 2016·Granted Mar 20, 2018·0 cites·17 claims
- 1656US9922914B2Plated terminals with routing interconnections semiconductor deviceUTAC THAI LTD·Filed 2016·Granted Mar 20, 2018·0 cites·12 claims
- 1756US9449905B2Plated terminals with routing interconnections semiconductor deviceUTAC THAI LTD·Filed 2013·Granted Sep 20, 2016·0 cites·16 claims
- 1852US9818676B2Singulation method for semiconductor package with plating on side of connectorsUTAC THAI LTD·Filed 2016·Granted Nov 14, 2017·0 cites·20 claims
- 1952US9029198B2Methods of manufacturing semiconductor devices including terminals with internal routing interconnectionsUTAC THAI LTD·Filed 2013·Granted May 12, 2015·0 cites·24 claims
- 2052US9000590B2Protruding terminals with internal routing interconnections semiconductor deviceUTAC THAI LTD·Filed 2013·Granted Apr 7, 2015·0 cites·15 claims
- 2151US8722461B2Leadframe based multi terminal IC packageUTAC THAI LTD·Filed 2013·Granted May 13, 2014·0 cites·18 claims
- 2250US8685794B2Lead frame land grid array with routing connector trace under unitUTAC THAI LTD·Filed 2013·Granted Apr 1, 2014·0 cites·20 claims
- 2349US2009241329A1Side rail removerUTAC THAI LTD·Filed 2009·Application pending·0 cites
- 2447US7656173B1Strip socket having a recessed portions in the base to accept bottom surface of packaged semiconductor devices mounted on a leadframe for testing and burn-inUTAC THAI LTD·Filed 2006·Granted Feb 2, 2010·2 cites·6 claims
- 2544US9355940B1Auxiliary leadframe member for stabilizing the bond wire processUTAC THAI LTD·Filed 2012·Granted May 31, 2016·0 cites·22 claims
- 2635US10586771B2Conductive shield for semiconductor packageUTAC THAI LTD·Filed 2014·Granted Mar 10, 2020·0 cites·20 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →