Assignee
UNITED TEST & ASSEMBLY CT LT
SG·15 granted patents·184 citations·filing 2006–2014
Top patents by PatentIndex Score
15 records- 0197US9142487B2Packaging structural memberUNITED TEST & ASSEMBLY CT LT·Filed 2013·Granted Sep 22, 2015·44 cites·20 claims
- 0296US8384203B2Packaging structural memberUNITED TEST & ASSEMBLY CT LT·Filed 2009·Granted Feb 26, 2013·50 cites·20 claims
- 0394US7948095B2Semiconductor package and method of making the sameUNITED TEST & ASSEMBLY CT LT·Filed 2009·Granted May 24, 2011·45 cites·3 claims
- 0488US9136142B2Semiconductor packages and methods of packaging semiconductor devicesUNITED TEST & ASSEMBLY CT LT·Filed 2014·Granted Sep 15, 2015·7 cites·24 claims
- 0580US9165878B2Semiconductor packages and methods of packaging semiconductor devicesUNITED TEST & ASSEMBLY CT LT·Filed 2013·Granted Oct 20, 2015·6 cites·25 claims
- 0678US7883938B2Stacked die semiconductor package and method of assemblyUNITED TEST & ASSEMBLY CT LT·Filed 2008·Granted Feb 8, 2011·13 cites·7 claims
- 0776US9087777B2Semiconductor packages and methods of packaging semiconductor devicesUNITED TEST & ASSEMBLY CT LT·Filed 2013·Granted Jul 21, 2015·3 cites·22 claims
- 0875US8741762B2Through silicon via dies and packagesUNITED TEST & ASSEMBLY CT LT·Filed 2013·Granted Jun 3, 2014·3 cites·21 claims
- 0973US9117808B2Semiconductor packages and methods of packaging semiconductor devicesUNITED TEST & ASSEMBLY CT LT·Filed 2014·Granted Aug 25, 2015·3 cites·20 claims
- 1068US8916422B2Semiconductor packages and methods of packaging semiconductor devicesUNITED TEST & ASSEMBLY CT LT·Filed 2013·Granted Dec 23, 2014·2 cites·23 claims
- 1164US8030761B2Mold design and semiconductor packageUNITED TEST & ASSEMBLY CT LT·Filed 2008·Granted Oct 4, 2011·2 cites·19 claims
- 1263US9312240B2Semiconductor packages and methods of packaging semiconductor devicesUNITED TEST & ASSEMBLY CT LT·Filed 2014·Granted Apr 12, 2016·2 cites·17 claims
- 1359US8030768B2Semiconductor package with under bump metallization aligned with open viasUNITED TEST & ASSEMBLY CT LT·Filed 2008·Granted Oct 4, 2011·2 cites·19 claims
- 1455US8039951B2Thermally enhanced semiconductor package and method of producing the sameUNITED TEST & ASSEMBLY CT LT·Filed 2006·Granted Oct 18, 2011·2 cites·9 claims
- 1554US9391026B2Semiconductor packages and methods of packaging semiconductor devicesUNITED TEST & ASSEMBLY CT LT·Filed 2014·Granted Jul 12, 2016·0 cites·20 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →