Assignee
ULTRA TERA CORP
US·5 granted patents·156 citations·filing 2002–2004
Top patents by PatentIndex Score
5 records- 0193US6713857B1Low profile stacked multi-chip semiconductor package with chip carrier having opening and fabrication method of the semiconductor packageULTRA TERA CORP·Filed 2002·Granted Mar 30, 2004·91 cites·20 claims
- 0285US6849915B1Light sensitive semiconductor package and fabrication method thereofULTRA TERA CORP·Filed 2003·Granted Feb 1, 2005·43 cites·16 claims
- 0362US6897566B2Encapsulated semiconductor package free of chip carrierULTRA TERA CORP·Filed 2002·Granted May 24, 2005·12 cites·15 claims
- 0451US6740540B2Fabrication method for circuit boardULTRA TERA CORP·Filed 2002·Granted May 25, 2004·4 cites·22 claims
- 0550US7122407B2Method for fabricating window ball grid array semiconductor packageULTRA TERA CORP·Filed 2004·Granted Oct 17, 2006·6 cites·11 claims
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