Assignee
UCHIDA MASAO
JP·7 granted patents·1 pending application·11 citations·filing 2007–2011
Top patents by PatentIndex Score
8 records- 0184US8563988B2Semiconductor element and manufacturing method thereforUCHIDA MASAO·Filed 2011·Granted Oct 22, 2013·6 cites·19 claims
- 0271US8809871B2Semiconductor element and semiconductor deviceUCHIDA MASAO·Filed 2011·Granted Aug 19, 2014·2 cites·8 claims
- 0361US8125005B2Semiconductor element and method for manufacturing sameUCHIDA MASAO·Filed 2007·Granted Feb 28, 2012·1 cites·15 claims
- 0460US8237172B2Semiconductor device having a silicon carbide substrate with an ohmic electrode layer in which a reaction layer is arranged in contact with the silicon carbide substrateUCHIDA MASAO·Filed 2008·Granted Aug 7, 2012·2 cites·10 claims
- 0545US8129758B2Semiconductor element and manufacturing method thereforUCHIDA MASAO·Filed 2009·Granted Mar 6, 2012·0 cites·13 claims
- 0645US8124984B2Semiconductor multilayer structure on an off-cut semiconductor substrateUCHIDA MASAO·Filed 2009·Granted Feb 28, 2012·0 cites·26 claims
- 0741US8575729B2Semiconductor chip with linear expansion coefficients in direction parallel to sides of hexagonal semiconductor substrate and manufacturing methodUCHIDA MASAO·Filed 2011·Granted Nov 5, 2013·0 cites·17 claims
- 0836US2012153303A1Semiconductor element and method for manufacturing sameUCHIDA MASAO·Filed 2010·Application pending·0 cites
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