Assignee
UCHIDA MAKOTO
JP·1 granted patent·3 pending applications·0 citations·filing 2007–2010
Top patents by PatentIndex Score
4 records- 0149US2010129604A1Copper foil with resin layerUCHIDA MAKOTO·Filed 2008·Application pending·0 cites
- 0240US2010233476A1Copper foil with primer resin layer and laminated sheet using the sameUCHIDA MAKOTO·Filed 2007·Application pending·0 cites
- 0337US8410620B2Primer resin for semiconductor device and semiconductor deviceUCHIDA MAKOTO·Filed 2008·Granted Apr 2, 2013·0 cites·8 claims
- 0430US2012178332A1Fiber Comprising Heat Curable Polyamide Resin Composition, Nonwoven Fabric And Producing Method ThereofUCHIDA MAKOTO·Filed 2010·Application pending·0 cites
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