Assignee
TTM TECHNOLOGIES INC
US·2 granted patents·14 citations·filing 2001–2003
Top patents by PatentIndex Score
2 records- 0159US6586687B2Printed wiring board with high density inner layer structureTTM TECHNOLOGIES INC·Filed 2001·Granted Jul 1, 2003·14 cites·9 claims
- 0232US7240313B2Method for analyzing material density variations on a multi-layer printed circuit boardTTM TECHNOLOGIES INC·Filed 2003·Granted Jul 3, 2007·0 cites·17 claims
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