Assignee
TSOU WEN-CHIEH
TW·4 granted patents·3 citations·filing 2009–2011
Top patents by PatentIndex Score
4 records- 0162US8879023B2Circuit substrate and light emitting diode packageTSOU WEN-CHIEH·Filed 2009·Granted Nov 4, 2014·2 cites·4 claims
- 0257US8283790B2Electronic deviceTSOU WEN-CHIEH·Filed 2010·Granted Oct 9, 2012·1 cites·20 claims
- 0351US8928837B2Circuit substrate and light emitting diode packageTSOU WEN-CHIEH·Filed 2011·Granted Jan 6, 2015·0 cites·16 claims
- 0437US8513820B2Package substrate structure and chip package structure and manufacturing process thereofTSOU WEN-CHIEH·Filed 2010·Granted Aug 20, 2013·0 cites·7 claims
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