Assignee
TSENG HSIANG-WEI
TW·2 granted patents·10 citations·filing 2011–2012
Top patents by PatentIndex Score
2 records- 0178US8488320B2Semiconductor package having a cooling fan and method of fabricating the sameTSENG HSIANG-WEI·Filed 2011·Granted Jul 16, 2013·7 cites·14 claims
- 0268US8680672B2Semiconductor package with sleeve member and fan wheel for heat dissipationTSENG HSIANG-WEI·Filed 2012·Granted Mar 25, 2014·3 cites·15 claims
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