Assignee
TRU SI TECHNOLOGIES INC
US·51 granted patents·1 pending application·4,973 citations·filing 1999–2007
Top patents by PatentIndex Score
52 records- 0199US7060601B2Packaging substrates for integrated circuits and soldering methodsTRU SI TECHNOLOGIES INC·Filed 2003·Granted Jun 13, 2006·394 cites·23 claims
- 0299US7049170B2Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavitiesTRU SI TECHNOLOGIES INC·Filed 2003·Granted May 23, 2006·429 cites·58 claims
- 0399US6882030B2Integrated circuit structures with a conductor formed in a through hole in a semiconductor substrate and protruding from a surface of the substrateTRU SI TECHNOLOGIES INC·Filed 2002·Granted Apr 19, 2005·401 cites·4 claims
- 0499US6740582B2Integrated circuits and methods for their fabricationTRU SI TECHNOLOGIES INC·Filed 2002·Granted May 25, 2004·403 cites·15 claims
- 0599US6693361B1Packaging of integrated circuits and vertical integrationTRU SI TECHNOLOGIES INC·Filed 2000·Granted Feb 17, 2004·427 cites·29 claims
- 0699US6322903B1Package of integrated circuits and vertical integrationTRU SI TECHNOLOGIES INC·Filed 1999·Granted Nov 27, 2001·903 cites·29 claims
- 0798US7241641B2Attachment of integrated circuit structures and other substrates to substrates with viasTRU SI TECHNOLOGIES INC·Filed 2005·Granted Jul 10, 2007·78 cites·27 claims
- 0898US7186586B2Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavitiesTRU SI TECHNOLOGIES INC·Filed 2005·Granted Mar 6, 2007·61 cites·27 claims
- 0998US7034401B2Packaging substrates for integrated circuits and soldering methodsTRU SI TECHNOLOGIES INC·Filed 2005·Granted Apr 25, 2006·101 cites·10 claims
- 1098US6787916B2Structures having a substrate with a cavity and having an integrated circuit bonded to a contact pad located in the cavityTRU SI TECHNOLOGIES INC·Filed 2001·Granted Sep 7, 2004·210 cites·17 claims
- 1197US6498381B2Semiconductor structures having multiple conductive layers in an opening, and methods for fabricating sameTRU SI TECHNOLOGIES INC·Filed 2001·Granted Dec 24, 2002·215 cites·50 claims
- 1296US6730540B2Clock distribution networks and conductive lines in semiconductor integrated circuitsTRU SI TECHNOLOGIES INC·Filed 2002·Granted May 4, 2004·96 cites·21 claims
- 1396US6717254B2Devices having substrates with opening passing through the substrates and conductors in the openings, and methods of manufactureTRU SI TECHNOLOGIES INC·Filed 2001·Granted Apr 6, 2004·117 cites·58 claims
- 1495US7510928B2Dielectric trenches, nickel/tantalum oxide structures, and chemical mechanical polishing techniquesTRU SI TECHNOLOGIES INC·Filed 2006·Granted Mar 31, 2009·31 cites·4 claims
- 1595US7173327B2Clock distribution networks and conductive lines in semiconductor integrated circuitsTRU SI TECHNOLOGIES INC·Filed 2005·Granted Feb 6, 2007·32 cites·17 claims
- 1695US6753205B2Method for manufacturing a structure comprising a substrate with a cavity and a semiconductor integrated circuit bonded to a contact pad located in the cavityTRU SI TECHNOLOGIES INC·Filed 2003·Granted Jun 22, 2004·96 cites·16 claims
- 1794US7241675B2Attachment of integrated circuit structures and other substrates to substrates with viasTRU SI TECHNOLOGIES INC·Filed 2004·Granted Jul 10, 2007·65 cites·29 claims
- 1894US6897148B2Electroplating and electroless plating of conductive materials into openings, and structures obtained therebyTRU SI TECHNOLOGIES INC·Filed 2003·Granted May 24, 2005·123 cites·80 claims
- 1993US6958285B2Methods of manufacturing devices having substrates with opening passing through the substrates and conductors in the openingsTRU SI TECHNOLOGIES INC·Filed 2002·Granted Oct 25, 2005·73 cites·57 claims
- 2093US6844241B2Fabrication of semiconductor structures having multiple conductive layers in an openingTRU SI TECHNOLOGIES INC·Filed 2001·Granted Jan 18, 2005·84 cites·64 claims
- 2193US6420209B1Integrated circuits and methods for their fabricationTRU SI TECHNOLOGIES INC·Filed 2000·Granted Jul 16, 2002·54 cites·7 claims
- 2292US7521360B2Electroplating and electroless plating of conductive materials into openings, and structures obtained therebyTRU SI TECHNOLOGIES INC·Filed 2006·Granted Apr 21, 2009·43 cites·8 claims
- 2391US6631935B1Detection and handling of semiconductor wafer and wafer-like objectsTRU SI TECHNOLOGIES INC·Filed 2000·Granted Oct 14, 2003·43 cites·9 claims
- 2491US6498074B2Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and cornersTRU SI TECHNOLOGIES INC·Filed 2001·Granted Dec 24, 2002·98 cites·17 claims
- 2590US6427991B1Non-contact workpiece holder using vortex chuck with central gas flowTRU SI TECHNOLOGIES INC·Filed 2000·Granted Aug 6, 2002·48 cites·19 claims
- 2687US7001825B2Semiconductor structures having multiple conductive layers in an opening, and methods for fabricating sameTRU SI TECHNOLOGIES INC·Filed 2004·Granted Feb 21, 2006·53 cites·8 claims
- 2785US7104579B2Detection and handling of semiconductor wafers and wafer-like objectsTRU SI TECHNOLOGIES INC·Filed 2004·Granted Sep 12, 2006·25 cites·17 claims
- 2884US6638004B2Article holders and article positioning methodsTRU SI TECHNOLOGIES INC·Filed 2001·Granted Oct 28, 2003·33 cites·35 claims
- 2983US6448153B2Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and cornersTRU SI TECHNOLOGIES INC·Filed 2000·Granted Sep 10, 2002·30 cites·28 claims
- 3082US6688662B2Detection and handling of semiconductor wafers and wafer-like objectsTRU SI TECHNOLOGIES INC·Filed 2002·Granted Feb 10, 2004·19 cites·14 claims
- 3182US6615113B2Articles holders with sensors detecting a type of article held by the holderTRU SI TECHNOLOGIES INC·Filed 2001·Granted Sep 2, 2003·21 cites·16 claims
- 3280US6665583B2Article holders with sensors detecting a type of article held by the holderTRU SI TECHNOLOGIES INC·Filed 2002·Granted Dec 16, 2003·18 cites·10 claims
- 3379US7144056B2Detection and handling of semiconductor wafers and wafers-like objectsTRU SI TECHNOLOGIES INC·Filed 2003·Granted Dec 5, 2006·17 cites·11 claims
- 3477US6323134B1Plasma processing methods and apparatusTRU SI TECHNOLOGIES INC·Filed 2000·Granted Nov 27, 2001·14 cites·28 claims
- 3574US6261375B1Plasma processing methods and apparatusTRU SI TECHNOLOGIES INC·Filed 2000·Granted Jul 17, 2001·16 cites·17 claims
- 3673US7027894B2Article holders with sensors detecting a type of article held by the holderTRU SI TECHNOLOGIES INC·Filed 2003·Granted Apr 11, 2006·13 cites·5 claims
- 3769US7052229B2Alignment of semiconductor wafers and other articlesTRU SI TECHNOLOGIES INC·Filed 2004·Granted May 30, 2006·9 cites·12 claims
- 3868US6948898B2Alignment of semiconductor wafers and other articlesTRU SI TECHNOLOGIES INC·Filed 2002·Granted Sep 27, 2005·9 cites·22 claims
- 3966US6627039B1Plasma processing methods and apparatusTRU SI TECHNOLOGIES INC·Filed 2000·Granted Sep 30, 2003·7 cites·12 claims
- 4061US6935830B2Alignment of semiconductor wafers and other articlesTRU SI TECHNOLOGIES INC·Filed 2001·Granted Aug 30, 2005·6 cites·26 claims
- 4161US6899788B2Article holders that use gas vortices to hold an article in a desired positionTRU SI TECHNOLOGIES INC·Filed 2003·Granted May 31, 2005·6 cites·3 claims
- 4261US6667242B2Brim and gas escape for non-contact wafer holderTRU SI TECHNOLOGIES INC·Filed 2001·Granted Dec 23, 2003·6 cites·12 claims
- 4358US6749764B1Plasma processing comprising three rotational motions of an article being processedTRU SI TECHNOLOGIES INC·Filed 2000·Granted Jun 15, 2004·5 cites·39 claims
- 4456US7179397B2Plasma processing methods and apparatusTRU SI TECHNOLOGIES INC·Filed 2003·Granted Feb 20, 2007·3 cites·9 claims
- 4555US6423923B1Monitoring and controlling separate plasma jets to achieve desired properties in a combined streamTRU SI TECHNOLOGIES INC·Filed 2000·Granted Jul 23, 2002·6 cites·17 claims
- 4655US6287976B1Plasma processing methods and apparatusTRU SI TECHNOLOGIES INC·Filed 1999·Granted Sep 11, 2001·18 cites·11 claims
- 4751US6541729B2Monitoring and controlling separate plasma jets to achieve desired properties in a combined streamTRU SI TECHNOLOGIES INC·Filed 2001·Granted Apr 1, 2003·3 cites·16 claims
- 4850US6448188B1Method of preventing motion of article in an article holderTRU SI TECHNOLOGIES INC·Filed 2001·Granted Sep 10, 2002·2 cites·4 claims
- 4949US6462300B2Monitoring and controlling separate plasma jets to achieve desired properties in a combined streamTRU SI TECHNOLOGIES INC·Filed 2001·Granted Oct 8, 2002·2 cites·15 claims
- 5047US6759341B1Wafering method comprising a plasma etch with a gas emitting wafer holderTRU SI TECHNOLOGIES INC·Filed 2003·Granted Jul 6, 2004·3 cites·13 claims
Showing the top 50 of 52 patent records by PatentIndex Score.
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