Assignee
TOWA CORP
JP·64 granted patents·42 pending applications·812 citations·filing 1992–2024
Top patents by PatentIndex Score
106 records- 0192US7682853B2Transparent member, optical device using transparent member and method of manufacturing optical deviceTOWA CORP·Filed 2006·Granted Mar 23, 2010·23 cites·6 claims
- 0287US5834035AMethod of and apparatus for molding resin to seal electronic partsTOWA CORP·Filed 1996·Granted Nov 10, 1998·91 cites·13 claims
- 0385US6358776B1Method of fabricating an electronic component and apparatus used thereforTOWA CORP·Filed 2000·Granted Mar 19, 2002·42 cites·12 claims
- 0485US5435953AMethod of molding resin for sealing an electronic deviceTOWA CORP·Filed 1993·Granted Jul 25, 1995·76 cites·12 claims
- 0583US7861624B2Method of and apparatus for working structureTOWA CORP·Filed 2007·Granted Jan 4, 2011·12 cites·14 claims
- 0683US7207868B2Cutting apparatusTOWA CORP·Filed 2006·Granted Apr 24, 2007·15 cites·3 claims
- 0783US6977188B2Resin encapsulation molding method of electronic part and resin encapsulation molding apparatus used thereforTOWA CORP·Filed 2003·Granted Dec 20, 2005·36 cites·9 claims
- 0882US6476507B1Resin sealing method and resin sealing apparatusTOWA CORP·Filed 2000·Granted Nov 5, 2002·37 cites·15 claims
- 0978US6773247B1Die used for resin-sealing and molding an electronic componentTOWA CORP·Filed 2000·Granted Aug 10, 2004·31 cites·11 claims
- 1077US6630374B2Resin sealing method and resin sealing apparatusTOWA CORP·Filed 2001·Granted Oct 7, 2003·24 cites·16 claims
- 1176US6346433B1Method of coating semiconductor wafer with resin and mold used thereforTOWA CORP·Filed 2000·Granted Feb 12, 2002·27 cites·17 claims
- 1275US11938660B2Mold die, resin molding apparatus, and method for producing resin molded productTOWA CORP·Filed 2020·Granted Mar 26, 2024·1 cites·5 claims
- 1375US7901797B2Low-adhesion material, resin molding die, and soil resistant materialTOWA CORP·Filed 2006·Granted Mar 8, 2011·2 cites·15 claims
- 1475US7811491B2Method for manufacturing optical electronic componentTOWA CORP·Filed 2005·Granted Oct 12, 2010·6 cites·4 claims
- 1575US5753538AMethod of sealing electronic parts with molded resin and mold employed thereforTOWA CORP·Filed 1995·Granted May 19, 1998·42 cites·26 claims
- 1675US5603879AMethod of molding resin to seal electronic parts using two evacuation stepsTOWA CORP·Filed 1994·Granted Feb 18, 1997·48 cites·17 claims
- 1774US6436331B1Method of resin sealing a gap between a semiconductor chip and a substrateTOWA CORP·Filed 2000·Granted Aug 20, 2002·13 cites·15 claims
- 1871US7614293B2Method of evaluating adhesion property, low-adhesion material, and mold for molding resinTOWA CORP·Filed 2005·Granted Nov 10, 2009·2 cites·1 claims
- 1970US7732037B2Conductive porous material, resin molding die employing the same, and method of preparing conductive porous materialTOWA CORP·Filed 2005·Granted Jun 8, 2010·2 cites·9 claims
- 2069US7784764B2Low-adhesion material, mold for molding resin using the same and contaminant adhesion preventing materialTOWA CORP·Filed 2005·Granted Aug 31, 2010·2 cites·11 claims
- 2169US6165232AMethod and apparatus for securely holding a substrate during dicingTOWA CORP·Filed 1998·Granted Dec 26, 2000·46 cites·22 claims
- 2269US5507633AResin molding apparatus for sealing an electronic deviceTOWA CORP·Filed 1994·Granted Apr 16, 1996·36 cites·13 claims
- 2368US5363777AWaste heat treatment apparatusTOWA CORP·Filed 1992·Granted Nov 15, 1994·38 cites·12 claims
- 2466US6919223B2Method of manufacturing semiconductor resin molding and resin member employed thereforTOWA CORP·Filed 2003·Granted Jul 19, 2005·13 cites·8 claims
- 2566US2025326053A1Processing device and method for manufacturing processed articleTOWA CORP·Filed 2022·Application pending·0 cites
- 2665US7439101B2Resin encapsulation molding method for semiconductor deviceTOWA CORP·Filed 2005·Granted Oct 21, 2008·5 cites·4 claims
- 2764US5874324AMethod of sealing electronic component with molded resinTOWA CORP·Filed 1997·Granted Feb 23, 1999·30 cites·16 claims
- 2863US11712823B2Molding die for compression molding with resin leakage prevention memberTOWA CORP·Filed 2021·Granted Aug 1, 2023·0 cites·9 claims
- 2963US7985357B2Method of resin-sealing and molding an optical deviceTOWA CORP·Filed 2006·Granted Jul 26, 2011·2 cites·6 claims
- 3063US6438826B2Electronic component, method of sealing electronic component with resin, and apparatus thereforTOWA CORP·Filed 2001·Granted Aug 27, 2002·13 cites·14 claims
- 3162US10170346B2Resin sealing apparatus and resin sealing methodTOWA CORP·Filed 2016·Granted Jan 1, 2019·2 cites·16 claims
- 3262US9728426B2Method for producing resin-encapsulated electronic component, bump-formed plate-like member, resin-encapsulated electronic component, and method for producing bump-formed plate-like memberTOWA CORP·Filed 2014·Granted Aug 8, 2017·2 cites·3 claims
- 3362US6736703B2Cutting apparatus and cutting methodTOWA CORP·Filed 2002·Granted May 18, 2004·8 cites·25 claims
- 3461US2024227251A1Method for producing resin molded product, film fixing member, liquid resin spreading mechanism and resin molding apparatusTOWA CORP·Filed 2024·Application pending·0 cites
- 3559US5783220AResin sealing and molding apparatus for sealing electronic partsTOWA CORP·Filed 1996·Granted Jul 21, 1998·19 cites·15 claims
- 3657US12564986B2Compression molding die, resin molding device, resin molding system, and method for manufacturing resin molded productTOWA CORP·Filed 2022·Granted Mar 3, 2026·0 cites·12 claims
- 3757US12194665B2Resin molding apparatus and method for producing resin molded productTOWA CORP·Filed 2021·Granted Jan 14, 2025·0 cites·6 claims
- 3857US9580827B2Method for producing electronic component, bump-formed plate-like member, electronic component, and method for producing bump-formed plate-like memberTOWA CORP·Filed 2015·Granted Feb 28, 2017·1 cites·45 claims
- 3957US7357694B2Jet singulationTOWA CORP·Filed 2006·Granted Apr 15, 2008·1 cites·13 claims
- 4057US6929977B2Method of introducing resin for electronic component and apparatus used thereforTOWA CORP·Filed 2003·Granted Aug 16, 2005·8 cites·7 claims
- 4157US2026027753A1Molding die, resin molding apparatus, and method for producing resin molded productTOWA CORP·Filed 2023·Application pending·0 cites
- 4256US7407146B2Composite material and resin moldTOWA CORP·Filed 2004·Granted Aug 5, 2008·3 cites·8 claims
- 4356US2025041978A1Processing device and method for manufacturing processed articleTOWA CORP·Filed 2022·Application pending·0 cites
- 4456US2025100108A1Processing device and method for manufacturing processed articleTOWA CORP·Filed 2022·Application pending·0 cites
- 4554US6851355B2Pressing method, pressing mechanism and resin molding deviceTOWA CORP·Filed 2001·Granted Feb 8, 2005·9 cites·7 claims
- 4654US2024326301A1Resin supply device, resin molding apparatus, and method for producing resin molded productTOWA CORP·Filed 2022·Application pending·0 cites
- 4753US2024009899A1Compression mold, resin molding apparatus, resin molding system, and method of manufacturing resin-molded productTOWA CORP·Filed 2021·Application pending·0 cites
- 4853US2023364833A1Method for manufacturing resin molded articleTOWA CORP·Filed 2021·Application pending·0 cites
- 4952US11833722B2Resin molding apparatus and method of manufacturing resin molded productTOWA CORP·Filed 2021·Granted Dec 5, 2023·0 cites·10 claims
- 5052US2026042243A1Resin molding device, and method for manufacturing resin molded articleTOWA CORP·Filed 2023·Application pending·0 cites
Showing the top 50 of 106 patent records by PatentIndex Score.
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