Assignee
TOHO ENGINEERING KABUSHIKI KAI
JP·6 granted patents·1 pending application·88 citations·filing 2001–2006
Top patents by PatentIndex Score
7 records- 0192US7121938B2Polishing pad and method of fabricating semiconductor substrate using the padTOHO ENGINEERING KABUSHIKI KAI·Filed 2003·Granted Oct 17, 2006·42 cites·9 claims
- 0281US7140088B2Turning tool for grooving polishing pad, apparatus and method of producing polishing pad using the tool, and polishing pad produced by using the toolTOHO ENGINEERING KABUSHIKI KAI·Filed 2006·Granted Nov 28, 2006·7 cites·16 claims
- 0377US7017246B2Turning tool for grooving polishing pad, apparatus and method of producing polishing pad using the tool, and polishing pad produced by using the toolTOHO ENGINEERING KABUSHIKI KAI·Filed 2004·Granted Mar 28, 2006·14 cites·16 claims
- 0472US6869343B2Turning tool for grooving polishing pad, apparatus and method of producing polishing pad using the tool, and polishing pad produced by using the toolTOHO ENGINEERING KABUSHIKI KAI·Filed 2001·Granted Mar 22, 2005·12 cites·9 claims
- 0570US7516536B2Method of producing polishing padTOHO ENGINEERING KABUSHIKI KAI·Filed 2005·Granted Apr 14, 2009·6 cites·16 claims
- 0664US7104868B2Turning tool for grooving polishing pad, apparatus and method of producing polishing pad using the tool, and polishing pad produced by using the toolTOHO ENGINEERING KABUSHIKI KAI·Filed 2004·Granted Sep 12, 2006·7 cites·9 claims
- 0752US2007032182A1Polishing pad and method of fabricating semiconductor substrate using the padTOHO ENGINEERING KABUSHIKI KAI·Filed 2006·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →