Assignee
THIN FILM MODULE INC
TW·13 granted patents·418 citations·filing 1999–2003
Top patents by PatentIndex Score
13 records- 0191US6320256B1Quick turn around fabrication process for packaging substrates and high density cardsTHIN FILM MODULE INC·Filed 2001·Granted Nov 20, 2001·57 cites·2 claims
- 0290US6753600B1Structure of a substrate for a high density semiconductor packageTHIN FILM MODULE INC·Filed 2003·Granted Jun 22, 2004·59 cites·21 claims
- 0388US6242279B1High density wire bond BGATHIN FILM MODULE INC·Filed 1999·Granted Jun 5, 2001·112 cites·9 claims
- 0480US6562656B1Cavity down flip chip BGATHIN FILM MODULE INC·Filed 2001·Granted May 13, 2003·31 cites·26 claims
- 0577US6331447B1High density flip chip BGATHIN FILM MODULE INC·Filed 2001·Granted Dec 18, 2001·18 cites·13 claims
- 0668US6291268B1Low cost method of testing a cavity-up BGA substrateTHIN FILM MODULE INC·Filed 2001·Granted Sep 18, 2001·15 cites·27 claims
- 0768US6221693B1High density flip chip BGATHIN FILM MODULE INC·Filed 1999·Granted Apr 24, 2001·30 cites·18 claims
- 0867US6277672B1BGA package for high density cavity-up wire bond device connections using a metal panel, thin film and build up multilayer technologyTHIN FILM MODULE INC·Filed 1999·Granted Aug 21, 2001·30 cites·29 claims
- 0965US6586846B2Low cost decal material used for packagingTHIN FILM MODULE INC·Filed 2001·Granted Jul 1, 2003·11 cites·7 claims
- 1060US6455926B2High density cavity-up wire bond BGATHIN FILM MODULE INC·Filed 2001·Granted Sep 24, 2002·8 cites·4 claims
- 1160US6287890B1Low cost decal material used for packagingTHIN FILM MODULE INC·Filed 1999·Granted Sep 11, 2001·22 cites·20 claims
- 1249US6197614B1Quick turn around fabrication process for packaging substrates and high density cardsTHIN FILM MODULE INC·Filed 1999·Granted Mar 6, 2001·13 cites·2 claims
- 1340US6294477B1Low cost high density thin film processingTHIN FILM MODULE INC·Filed 1999·Granted Sep 25, 2001·12 cites·20 claims
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