Assignee
THEUSS HORST
DE·19 granted patents·6 pending applications·281 citations·filing 2006–2012
Top patents by PatentIndex Score
25 records- 0198US8080993B2Sensor module with mold encapsulation for applying a bias magnetic fieldTHEUSS HORST·Filed 2008·Granted Dec 20, 2011·67 cites·20 claims
- 0297US8253210B2Semiconductor device including a magnetic sensor chipTHEUSS HORST·Filed 2009·Granted Aug 28, 2012·59 cites·22 claims
- 0397US8106654B2Magnetic sensor integrated circuit device and methodTHEUSS HORST·Filed 2008·Granted Jan 31, 2012·55 cites·22 claims
- 0495US8841785B2Energy harvesterTHEUSS HORST·Filed 2008·Granted Sep 23, 2014·45 cites·16 claims
- 0590US8559139B2Sensor module and method for manufacturing a sensor moduleTHEUSS HORST·Filed 2007·Granted Oct 15, 2013·20 cites·20 claims
- 0686US9324586B2Chip-packaging module for a chip and a method for forming a chip-packaging moduleTHEUSS HORST·Filed 2011·Granted Apr 26, 2016·8 cites·23 claims
- 0781US8991253B2Microelectromechanical systemTHEUSS HORST·Filed 2011·Granted Mar 31, 2015·4 cites·12 claims
- 0881US8426251B2Semiconductor deviceTHEUSS HORST·Filed 2010·Granted Apr 23, 2013·6 cites·18 claims
- 0973US9075078B2Microelectromechanical accelerometer with wireless transmission capabilitiesTHEUSS HORST·Filed 2011·Granted Jul 7, 2015·3 cites·12 claims
- 1072US8767983B2Module including a micro-electro-mechanical microphoneTHEUSS HORST·Filed 2007·Granted Jul 1, 2014·5 cites·39 claims
- 1169US8912638B2Semiconductor device with hollow structureTHEUSS HORST·Filed 2011·Granted Dec 16, 2014·2 cites·16 claims
- 1264US9076717B2Semiconductor component comprising magnetic field sensorTHEUSS HORST·Filed 2006·Granted Jul 7, 2015·2 cites·19 claims
- 1362US8729697B2Sensor arrangement, a measurement circuit, chip-packages and a method for forming a sensor arrangementTHEUSS HORST·Filed 2012·Granted May 20, 2014·1 cites·25 claims
- 1462US8580612B2Chip assemblyTHEUSS HORST·Filed 2009·Granted Nov 12, 2013·2 cites·21 claims
- 1560US8482135B2Method for producing a component and device having a componentTHEUSS HORST·Filed 2007·Granted Jul 9, 2013·2 cites·23 claims
- 1653US9177879B2Sensor moduleTHEUSS HORST·Filed 2012·Granted Nov 3, 2015·0 cites·12 claims
- 1751US8130506B2Sensor moduleTHEUSS HORST·Filed 2008·Granted Mar 6, 2012·0 cites·25 claims
- 1849US8207018B2Semiconductor packageTHEUSS HORST·Filed 2010·Granted Jun 26, 2012·0 cites·20 claims
- 1948US8900715B2Semiconductor deviceTHEUSS HORST·Filed 2008·Granted Dec 2, 2014·0 cites·12 claims
- 2044US2008164598A1Semiconductor moduleTHEUSS HORST·Filed 2007·Application pending·0 cites
- 2142US2014071642A1Low stress component packageTHEUSS HORST·Filed 2012·Application pending·0 cites
- 2242US2006164796A1Electronic component for radio frequency applications and method for producing the sameTHEUSS HORST·Filed 2006·Application pending·0 cites
- 2341US2006186525A1Electronic component with stacked semiconductor chips and method for producing the sameTHEUSS HORST·Filed 2006·Application pending·0 cites
- 2441US2013260510A13-D Integrated Circuits and Methods of Forming ThereofTHEUSS HORST·Filed 2012·Application pending·0 cites
- 2541US2013234330A1Semiconductor Packages and Methods of Formation ThereofTHEUSS HORST·Filed 2012·Application pending·0 cites
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