Assignee
TEZZARON SEMICONDUCTOR INC
US·2 granted patents·249 citations·filing 2006–2006
Technology mixH10W2
Top patents by PatentIndex Score
2 records- 0197US7750488B2Method for bonding wafers to produce stacked integrated circuitsTEZZARON SEMICONDUCTOR INC·Filed 2006·Granted Jul 6, 2010·222 cites·17 claims
- 0291US7898095B2Fiducial scheme adapted for stacked integrated circuitsTEZZARON SEMICONDUCTOR INC·Filed 2006·Granted Mar 1, 2011·27 cites·6 claims
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