Assignee
TESSERA INTERCONNECT MATERIALS
US·6 granted patents·8 pending applications·61 citations·filing 2004–2009
Top patents by PatentIndex Score
14 records- 0186US7238603B2Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrateTESSERA INTERCONNECT MATERIALS·Filed 2005·Granted Jul 3, 2007·13 cites·8 claims
- 0281US7721422B2Methods of making microelectronic assembliesTESSERA INTERCONNECT MATERIALS·Filed 2007·Granted May 25, 2010·7 cites·20 claims
- 0381US7546681B2Manufacturing method for wiring circuit substrateTESSERA INTERCONNECT MATERIALS·Filed 2006·Granted Jun 16, 2009·6 cites·13 claims
- 0481US7342802B2Multilayer wiring board for an electronic deviceTESSERA INTERCONNECT MATERIALS·Filed 2004·Granted Mar 11, 2008·20 cites·26 claims
- 0579US7096578B2Manufacturing method for wiring circuit substrateTESSERA INTERCONNECT MATERIALS·Filed 2004·Granted Aug 29, 2006·15 cites·14 claims
- 0653US2008296254A1Multilayer wiring board for an electronic deviceTESSERA INTERCONNECT MATERIALS·Filed 2008·Application pending·0 cites
- 0752US7505281B2Multilayer wiring board for an electronic deviceTESSERA INTERCONNECT MATERIALS·Filed 2007·Granted Mar 17, 2009·0 cites·21 claims
- 0851US2010044860A1Microelectronic substrate or element having conductive pads and metal posts joined thereto using bond layerTESSERA INTERCONNECT MATERIALS·Filed 2009·Application pending·0 cites
- 0948US2010071944A1Chip capacitor embedded pwbTESSERA INTERCONNECT MATERIALS·Filed 2007·Application pending·0 cites
- 1041US2008264678A1Member for Interconnecting Wiring Films and Method for Producing the SameTESSERA INTERCONNECT MATERIALS·Filed 2005·Application pending·0 cites
- 1138US2008136041A1Structure and method of making interconnect element having metal traces embedded in surface of dielectricTESSERA INTERCONNECT MATERIALS·Filed 2007·Application pending·0 cites
- 1235US2008128288A1Method of manufacturing a multi-layer wiring board using a metal member having a rough surfaceTESSERA INTERCONNECT MATERIALS·Filed 2007·Application pending·0 cites
- 1334US2007221329A1Apparatus and method for distributing a liquid onto a surface of an itemTESSERA INTERCONNECT MATERIALS·Filed 2006·Application pending·0 cites
- 1433US2008169568A1Structure and method of making interconnect element having metal traces embedded in surface of dielectricTESSERA INTERCONNECT MATERIALS·Filed 2007·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →