Assignee
TEMPER IP LLC
US·8 granted patents·6 pending applications·155 citations·filing 2013–2025
Top patents by PatentIndex Score
14 records- 0194US9555580B1Friction stir welding fastenerTEMPER IP LLC·Filed 2014·Granted Jan 31, 2017·140 cites·30 claims
- 0289US9656317B1Stamp, mold, quench of aluminum and magnesium sheetTEMPER IP LLC·Filed 2015·Granted May 23, 2017·10 cites·31 claims
- 0382US9174263B2Tool and shell using induction heatingTEMPER IP LLC·Filed 2013·Granted Nov 3, 2015·3 cites·17 claims
- 0477US10307810B1Tool and shell using induction heatingTEMPER IP LLC·Filed 2015·Granted Jun 4, 2019·1 cites·12 claims
- 0574US11338344B1Tool and shell using induction heatingTEMPER IP LLC·Filed 2019·Granted May 24, 2022·0 cites·40 claims
- 0671US2026054458A1Structure repair using ferromagnetic induction heating and thermoplastic adhesiveTEMPER IP LLC·Filed 2025·Application pending·0 cites
- 0767US9032772B2Method and process for forming a productTEMPER IP LLC·Filed 2013·Granted May 19, 2015·1 cites·14 claims
- 0865US2019291185A1Powdered material preform and process of forming sameTEMPER IP LLC·Filed 2019·Application pending·0 cites
- 0958US2024149991A1Below water-line hull repair system using composite patch heated by ferromagnetic heating deviceTEMPER IP LLC·Filed 2023·Application pending·0 cites
- 1055US2025332653A1System for heating components for curing and bonding multi-component structuresTEMPER IP LLC·Filed 2022·Application pending·0 cites
- 1152US2017095861A1Powdered material preform and process of forming sameTEMPER IP LLC·Filed 2015·Application pending·0 cites
- 1251US10981209B2Forming process using magnetic fieldsTEMPER IP LLC·Filed 2015·Granted Apr 20, 2021·0 cites·20 claims
- 1350US12583031B2Method for densification of powdered material using thermal cycling and magnetic cyclingTEMPER IP LLC·Filed 2021·Granted Mar 24, 2026·0 cites·32 claims
- 1449US2024375387A1Phenolic panel and attachment/detachment system and processTEMPER IP LLC·Filed 2022·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →