Assignee
TEKA INTERCONNECTIONS SYSTEMS
US·4 granted patents·1 pending application·46 citations·filing 2000–2006
Top patents by PatentIndex Score
5 records- 0177US6543129B2Solder-bearing contacts and method of manufacture thereof and use in a solder ball grid array connectorTEKA INTERCONNECTIONS SYSTEMS·Filed 2001·Granted Apr 8, 2003·26 cites·49 claims
- 0275US6900393B1Solder-bearing wafer for use in soldering operationsTEKA INTERCONNECTIONS SYSTEMS·Filed 2000·Granted May 31, 2005·18 cites·30 claims
- 0362US7754979B2Solder-bearing wafer for use in soldering operationsTEKA INTERCONNECTIONS SYSTEMS·Filed 2006·Granted Jul 13, 2010·2 cites·22 claims
- 0443US7259335B2Solder-bearing wafer for use in soldering operationsTEKA INTERCONNECTIONS SYSTEMS·Filed 2004·Granted Aug 21, 2007·0 cites·13 claims
- 0534US2002061687A1Solder bearing grid arrayTEKA INTERCONNECTIONS SYSTEMS·Filed 2001·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →