Assignee
TEIKOKU SEIKI KK
JP·3 granted patents·40 citations·filing 1987–1994
Top patents by PatentIndex Score
3 records- 0154US4779497ADevice and method of cutting off a portion of masking film adhered to a silicon waferTEIKOKU SEIKI KK·Filed 1987·Granted Oct 25, 1988·15 cites·8 claims
- 0243US5590445ATape extension device for semiconductor producing apparatus and semiconductor producing apparatus with tape extension deviceTEIKOKU SEIKI KK·Filed 1994·Granted Jan 7, 1997·15 cites·26 claims
- 0336US5281297AMethod of supporting wafer, wafer supporting apparatus and wafer mounter having the apparatusTEIKOKU SEIKI KK·Filed 1991·Granted Jan 25, 1994·10 cites·6 claims
Join the waitlist — get patent alerts
Get an alert when TEIKOKU SEIKI KK files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →