Assignee
TAKAZONO CORP
JP·6 granted patents·8 pending applications·4 citations·filing 2009–2025
Top patents by PatentIndex Score
14 records- 0180US11866214B2Packaging device, wound body, core tube, method for manufacturing wound body, and wound materialTAKAZONO CORP·Filed 2020·Granted Jan 9, 2024·2 cites·6 claims
- 0279US12103799B2Wound body, core body for wound body, and combination of wound body and support shaftTAKAZONO CORP·Filed 2020·Granted Oct 1, 2024·2 cites·7 claims
- 0371US12595086B2Packaging device, wound body, core tube, method for manufacturing wound body, and wound materialTAKAZONO CORP·Filed 2025·Granted Apr 7, 2026·0 cites·3 claims
- 0471US12297001B2Packaging device, wound body, core tube, method for manufacturing wound body, and wound materialTAKAZONO CORP·Filed 2024·Granted May 13, 2025·0 cites·6 claims
- 0562US2026027012A1Medicine Feeding ApparatusTAKAZONO CORP·Filed 2023·Application pending·0 cites
- 0661US2026027007A1Manual Medicine Distributing ApparatusTAKAZONO CORP·Filed 2023·Application pending·0 cites
- 0756US2025127686A1Manual Medicine Distributing ApparatusTAKAZONO CORP·Filed 2022·Application pending·0 cites
- 0856US2025064679A1Medicine Feeding ApparatusTAKAZONO CORP·Filed 2022·Application pending·0 cites
- 0951US2023329975A1Drug supply deviceTAKAZONO CORP·Filed 2021·Application pending·0 cites
- 1051US2011163112A1Medication Container and Medication Dispensing ApparatusTAKAZONO CORP·Filed 2009·Application pending·0 cites
- 1147US2015101282A1Medicine Dispensing and Packing ApparatusTAKAZONO CORP·Filed 2013·Application pending·0 cites
- 1245US12266435B2Medicine dispensing apparatusTAKAZONO CORP·Filed 2021·Granted Apr 1, 2025·0 cites·12 claims
- 1343US2022304896A1Medicine supply deviceTAKAZONO CORP·Filed 2020·Application pending·0 cites
- 1440US12065276B2Wound body, core body for wound body, combination of wound body and support shaft, and combination of wound body and medical packing apparatusTAKAZONO CORP·Filed 2021·Granted Aug 20, 2024·0 cites·21 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →