Assignee
TAIYO SHIGYO CO LTD
JP·2 granted patents·2 citations·filing 2016–2019
Top patents by PatentIndex Score
2 records- 0154US10800560B2Packaging kit, package, packaging method using packaging kit, packaging kit manufacturing apparatus, and packaging kit manufacturing methodTAIYO SHIGYO CO LTD·Filed 2016·Granted Oct 13, 2020·2 cites·19 claims
- 0236US10940970B2Packaging kit and packaging setTAIYO SHIGYO CO LTD·Filed 2019·Granted Mar 9, 2021·0 cites·16 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →