Assignee
TAIWAN SOLUTIONS SYSTEMS CORP
TW·1 granted patent·6 pending applications·0 citations·filing 2005–2010
Top patents by PatentIndex Score
7 records- 0134US2008217759A1Chip package substrate and structure thereofTAIWAN SOLUTIONS SYSTEMS CORP·Filed 2007·Application pending·0 cites
- 0234US2007194430A1Substrate of chip package and chip package structure thereofTAIWAN SOLUTIONS SYSTEMS CORP·Filed 2007·Application pending·0 cites
- 0333US2009294952A1Chip package carrier and fabrication method thereofTAIWAN SOLUTIONS SYSTEMS CORP·Filed 2008·Application pending·0 cites
- 0431US2007228541A1Method for fabricating chip package structureTAIWAN SOLUTIONS SYSTEMS CORP·Filed 2007·Application pending·0 cites
- 0530US2009108444A1Chip package structure and its fabrication methodTAIWAN SOLUTIONS SYSTEMS CORP·Filed 2007·Application pending·0 cites
- 0629US2010301365A1Light emitting diode module and manufacture method thereofTAIWAN SOLUTIONS SYSTEMS CORP·Filed 2010·Application pending·0 cites
- 0716US7320901B2Fabrication method for a chip packaging structureTAIWAN SOLUTIONS SYSTEMS CORP·Filed 2005·Granted Jan 22, 2008·0 cites·21 claims
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