Assignee
TAIWAN IC PACKAGING CORP
TW·2 granted patents·2 pending applications·2 citations·filing 2002–2015
Top patents by PatentIndex Score
4 records- 0165US9140600B2Optical proximity sensor and manufacturing method thereofTAIWAN IC PACKAGING CORP·Filed 2013·Granted Sep 22, 2015·2 cites·12 claims
- 0240US2015357505A1Optical proximity sensor and manufacturing method thereofTAIWAN IC PACKAGING CORP·Filed 2015·Application pending·0 cites
- 0324US2004089926A1Ultra thin semiconductor deviceTAIWAN IC PACKAGING CORP·Filed 2002·Application pending·0 cites
- 0420US7238897B2Contact sensor and method for making the sameTAIWAN IC PACKAGING CORP·Filed 2005·Granted Jul 3, 2007·0 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when TAIWAN IC PACKAGING CORP files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →