Assignee
SUH DAEWOONG
US·4 granted patents·19 pending applications·7 citations·filing 2004–2010
Top patents by PatentIndex Score
23 records- 0175US7867818B2Methods and apparatuses for providing stacked-die devicesSUH DAEWOONG·Filed 2005·Granted Jan 11, 2011·6 cites·15 claims
- 0266US8100314B2Carbon nanotubes solder composite for high performance interconnectSUH DAEWOONG·Filed 2010·Granted Jan 24, 2012·1 cites·15 claims
- 0356US2010037990A1Bulk metallic glass solder materialSUH DAEWOONG·Filed 2009·Application pending·0 cites
- 0453US8436470B2Solder joint reliability in microelectronic packagingSUH DAEWOONG·Filed 2010·Granted May 7, 2013·0 cites·10 claims
- 0549US2009242121A1Low stress, low-temperature metal-metal composite flip chip interconnectSUH DAEWOONG·Filed 2008·Application pending·0 cites
- 0648US2005255636A1Microtools for package substrate patterningSUH DAEWOONG·Filed 2005·Application pending·0 cites
- 0747US2007235500A1Room temperature joining process with piezoelectric ceramic-activated reactive multilayer foilSUH DAEWOONG·Filed 2006·Application pending·0 cites
- 0847US2007227627A1Solder composition having dispersoid particles for increased creep resistanceSUH DAEWOONG·Filed 2006·Application pending·0 cites
- 0946US2007152026A1Transient liquid phase bonding methodSUH DAEWOONG·Filed 2005·Application pending·0 cites
- 1044US2006067852A1Low melting-point solders, articles made thereby, and processes of making sameSUH DAEWOONG·Filed 2004·Application pending·0 cites
- 1143US2008224327A1Microelectronic substrate including bumping sites with nanostructuresSUH DAEWOONG·Filed 2007·Application pending·0 cites
- 1243US2008035703A1Oxidation resistant solder preformSUH DAEWOONG·Filed 2006·Application pending·0 cites
- 1343US2008225490A1Thermal interface materialsSUH DAEWOONG·Filed 2007·Application pending·0 cites
- 1443US2008227294A1Method of making an interconnect structureSUH DAEWOONG·Filed 2007·Application pending·0 cites
- 1542US9929080B2Forming a stress compensation layer and structures formed therebySUH DAEWOONG·Filed 2004·Granted Mar 27, 2018·0 cites·11 claims
- 1642US2005221112A1Microtools for package substrate patterningSUH DAEWOONG·Filed 2004·Application pending·0 cites
- 1742US2008156475A1Thermal interfaces in electronic systemsSUH DAEWOONG·Filed 2006·Application pending·0 cites
- 1839US2007075430A1Solder joint intermetallic compounds with improved ductility and toughnessSUH DAEWOONG·Filed 2005·Application pending·0 cites
- 1938US2005277286A1Metallic glass microtoolSUH DAEWOONG·Filed 2004·Application pending·0 cites
- 2038US2009004500A1Multilayer preform for fast transient liquid phase bondingSUH DAEWOONG·Filed 2007·Application pending·0 cites
- 2137US2008233682A1Methods of forming a cored metallic thermal interface material and structures formed therebySUH DAEWOONG·Filed 2007·Application pending·0 cites
- 2235US2005224951A1Jet-dispensed stress relief layer in contact arrays, and processes of making sameSUH DAEWOONG·Filed 2004·Application pending·0 cites
- 2335US2008185718A1Nanostructure-Based Package InterconnectSUH DAEWOONG·Filed 2008·Application pending·0 cites
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