Assignee
SU ZHOU DREAM TECH CO LTD
CN·2 granted patents·0 citations·filing 2018–2018
Top patents by PatentIndex Score
2 records- 0136US11952487B2Resin spacer for chip stacking and packaging and preparation method thereofSU ZHOU DREAM TECH CO LTD·Filed 2018·Granted Apr 9, 2024·0 cites·15 claims
- 0229US11462448B2Step-type stacked chip packaging structure based on resin spacer and preparation processSU ZHOU DREAM TECH CO LTD·Filed 2018·Granted Oct 4, 2022·0 cites·16 claims
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