Assignee
SU HUNG-WEN
TW·1 granted patent·2 pending applications·2 citations·filing 2004–2010
Top patents by PatentIndex Score
3 records- 0169US9123781B2Semiconductor device and method for forming the sameSU HUNG-WEN·Filed 2010·Granted Sep 1, 2015·2 cites·4 claims
- 0235US2006138668A1Passivation structure for semiconductor devicesSU HUNG-WEN·Filed 2004·Application pending·0 cites
- 0334US2005211379A1Apparatus and method for removing metal from wafer edgeSU HUNG-WEN·Filed 2004·Application pending·0 cites
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