Assignee
STAKTEK CORP
US·49 granted patents·4,482 citations·filing 1991–1998
Top patents by PatentIndex Score
49 records- 0199US5484959AHigh density lead-on-package fabrication method and apparatusSTAKTEK CORP·Filed 1992·Granted Jan 16, 1996·232 cites·43 claims
- 0299US5279029AUltra high density integrated circuit packages methodSTAKTEK CORP·Filed 1993·Granted Jan 18, 1994·467 cites·24 claims
- 0398US5221642ALead-on-chip integrated circuit fabrication methodSTAKTEK CORP·Filed 1991·Granted Jun 22, 1993·345 cites·43 claims
- 0497US5631193AHigh density lead-on-package fabrication methodSTAKTEK CORP·Filed 1995·Granted May 20, 1997·119 cites·8 claims
- 0596US5550711AUltra high density integrated circuit packagesSTAKTEK CORP·Filed 1995·Granted Aug 27, 1996·164 cites·7 claims
- 0696US5420751AUltra high density modular integrated circuit packageSTAKTEK CORP·Filed 1993·Granted May 30, 1995·160 cites·32 claims
- 0795US5552963ABus communication system for stacked high density integrated circuit packagesSTAKTEK CORP·Filed 1995·Granted Sep 3, 1996·142 cites·1 claims
- 0895US5455740ABus communication system for stacked high density integrated circuit packagesSTAKTEK CORP·Filed 1994·Granted Oct 3, 1995·119 cites·22 claims
- 0993US5644161AUltra-high density warp-resistant memory moduleSTAKTEK CORP·Filed 1995·Granted Jul 1, 1997·115 cites·17 claims
- 1093US5585668AIntegrated circuit package with overlapped die on a common lead frameSTAKTEK CORP·Filed 1996·Granted Dec 17, 1996·76 cites·19 claims
- 1193US5572065AHermetically sealed ceramic integrated circuit heat dissipating packageSTAKTEK CORP·Filed 1994·Granted Nov 5, 1996·128 cites·63 claims
- 1293US5566051AUltra high density integrated circuit packages method and apparatusSTAKTEK CORP·Filed 1994·Granted Oct 15, 1996·98 cites·17 claims
- 1393US5543664AUltra high density integrated circuit packageSTAKTEK CORP·Filed 1995·Granted Aug 6, 1996·105 cites·11 claims
- 1493US5479318ABus communication system for stacked high density integrated circuit packages with trifurcated distal lead endsSTAKTEK CORP·Filed 1995·Granted Dec 26, 1995·96 cites·8 claims
- 1592US5801437AThree-dimensional warp-resistant integrated circuit module method and apparatusSTAKTEK CORP·Filed 1995·Granted Sep 1, 1998·113 cites·2 claims
- 1692US5493476ABus communication system for stacked high density integrated circuit packages with bifurcated distal lead endsSTAKTEK CORP·Filed 1995·Granted Feb 20, 1996·95 cites·15 claims
- 1791US5654877ALead-on-chip integrated circuit apparatusSTAKTEK CORP·Filed 1995·Granted Aug 5, 1997·99 cites·11 claims
- 1891US5446620AUltra high density integrated circuit packagesSTAKTEK CORP·Filed 1993·Granted Aug 29, 1995·95 cites·28 claims
- 1990US6049123AUltra high density integrated circuit packagesSTAKTEK CORP·Filed 1997·Granted Apr 11, 2000·80 cites·20 claims
- 2090US6025642AUltra high density integrated circuit packagesSTAKTEK CORP·Filed 1997·Granted Feb 15, 2000·112 cites·6 claims
- 2190US5843807AMethod of manufacturing an ultra-high density warp-resistant memory moduleSTAKTEK CORP·Filed 1996·Granted Dec 1, 1998·88 cites·14 claims
- 2290US5499160AHigh density integrated circuit module with snap-on rail assembliesSTAKTEK CORP·Filed 1995·Granted Mar 12, 1996·115 cites·17 claims
- 2390US5377077AUltra high density integrated circuit packages method and apparatusSTAKTEK CORP·Filed 1993·Granted Dec 27, 1994·114 cites·22 claims
- 2489US5783464AMethod of forming a hermetically sealed circuit lead-on packageSTAKTEK CORP·Filed 1997·Granted Jul 21, 1998·92 cites·14 claims
- 2587US5804870AHermetically sealed integrated circuit lead-on package configurationSTAKTEK CORP·Filed 1995·Granted Sep 8, 1998·85 cites·11 claims
- 2687US5592364AHigh density integrated circuit module with complex electrical interconnect railsSTAKTEK CORP·Filed 1995·Granted Jan 7, 1997·91 cites·9 claims
- 2787US5528075ALead-on-chip integrated circuit apparatusSTAKTEK CORP·Filed 1995·Granted Jun 18, 1996·73 cites·10 claims
- 2886USRE36229ESimulcast standard multichip memory addressing systemSTAKTEK CORP·Filed 1995·Granted Jun 15, 1999·57 cites·9 claims
- 2986US5828125AUltra-high density warp-resistant memory moduleSTAKTEK CORP·Filed 1996·Granted Oct 27, 1998·68 cites·4 claims
- 3086US5561591AMulti-signal rail assembly with impedance control for a three-dimensional high density integrated circuit packageSTAKTEK CORP·Filed 1994·Granted Oct 1, 1996·58 cites·22 claims
- 3186US5367766AUltra high density integrated circuit packages methodSTAKTEK CORP·Filed 1993·Granted Nov 29, 1994·87 cites·15 claims
- 3283US5778522AMethod of manufacturing a high density integrated circuit module with complex electrical interconnect rails having electrical interconnect strain reliefSTAKTEK CORP·Filed 1996·Granted Jul 14, 1998·56 cites·1 claims
- 3383US5615475AMethod of manufacturing an integrated package having a pair of die on a common lead frameSTAKTEK CORP·Filed 1995·Granted Apr 1, 1997·40 cites·23 claims
- 3481US5371866ASimulcast standard multichip memory addressing systemSTAKTEK CORP·Filed 1992·Granted Dec 6, 1994·43 cites·5 claims
- 3580US5369056AWarp-resistent ultra-thin integrated circuit package fabrication methodSTAKTEK CORP·Filed 1993·Granted Nov 29, 1994·43 cites·18 claims
- 3678US5864175AWrap-resistant ultra-thin integrated circuit package fabrication methodSTAKTEK CORP·Filed 1996·Granted Jan 26, 1999·36 cites·12 claims
- 3778US5369058AWarp-resistent ultra-thin integrated circuit package fabrication methodSTAKTEK CORP·Filed 1994·Granted Nov 29, 1994·40 cites·18 claims
- 3876US5588205AMethod of manufacturing a high density integrated circuit module having complex electrical interconnect railsSTAKTEK CORP·Filed 1995·Granted Dec 31, 1996·51 cites·6 claims
- 3974US5236117AImpact solder method and apparatusSTAKTEK CORP·Filed 1992·Granted Aug 17, 1993·30 cites·10 claims
- 4073US5960539AMethod of making high density integrated circuit moduleSTAKTEK CORP·Filed 1998·Granted Oct 5, 1999·34 cites·10 claims
- 4172US5498906ACapacitive coupling configuration for an intergrated circuit packageSTAKTEK CORP·Filed 1993·Granted Mar 12, 1996·44 cites·37 claims
- 4272US5448450ALead-on-chip integrated circuit apparatusSTAKTEK CORP·Filed 1991·Granted Sep 5, 1995·35 cites·9 claims
- 4371US5978227AIntegrated circuit packages having an externally mounted lead frame having bifurcated distal lead endsSTAKTEK CORP·Filed 1996·Granted Nov 2, 1999·25 cites·4 claims
- 4467US5702985AHermetically sealed ceramic integrated circuit heat dissipating package fabrication methodSTAKTEK CORP·Filed 1994·Granted Dec 30, 1997·31 cites·56 claims
- 4565US5586009ABus communication system for stacked high density integrated circuit packagesSTAKTEK CORP·Filed 1996·Granted Dec 17, 1996·20 cites·1 claims
- 4663US5605592AMethod of manufacturing a bus communication system for stacked high density integrated circuit packagesSTAKTEK CORP·Filed 1995·Granted Feb 25, 1997·18 cites·5 claims
- 4760US5581121AWarp-resistant ultra-thin integrated circuit packageSTAKTEK CORP·Filed 1994·Granted Dec 3, 1996·19 cites·12 claims
- 4854US5945732AApparatus and method of manufacturing a warp resistant thermally conductive integrated circuit packageSTAKTEK CORP·Filed 1997·Granted Aug 31, 1999·16 cites·11 claims
- 4949US5895232AThree-dimensional warp-resistant integrated circuit module method and apparatusSTAKTEK CORP·Filed 1997·Granted Apr 20, 1999·13 cites·7 claims
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