Assignee
ST ASSEMBLY TEST SERVICES PTE
SG·37 granted patents·1 pending application·1,056 citations·filing 1998–2004
Top patents by PatentIndex Score
38 records- 0195US6380048B1Die paddle enhancement for exposed pad in semiconductor packagingST ASSEMBLY TEST SERVICES PTE·Filed 2001·Granted Apr 30, 2002·228 cites·16 claims
- 0290US6740577B2Method of forming a small pitch torch bump for mounting high-performance flip-flop devicesST ASSEMBLY TEST SERVICES PTE·Filed 2002·Granted May 25, 2004·75 cites·35 claims
- 0390US6432742B1Methods of forming drop-in heat spreader plastic ball grid array (PBGA) packagesST ASSEMBLY TEST SERVICES PTE·Filed 2000·Granted Aug 13, 2002·90 cites·31 claims
- 0488US6278613B1Copper pads for heat spreader attachST ASSEMBLY TEST SERVICES PTE·Filed 2000·Granted Aug 21, 2001·94 cites·44 claims
- 0584US6875634B2Heat spreader anchoring and grounding method and thermally enhanced PBGA package using the sameST ASSEMBLY TEST SERVICES PTE·Filed 2004·Granted Apr 5, 2005·36 cites·21 claims
- 0684US6841858B2Leadframe for die stacking applications and related die stacking conceptsST ASSEMBLY TEST SERVICES PTE·Filed 2002·Granted Jan 11, 2005·36 cites·84 claims
- 0783US6876069B2Ground plane for exposed packageST ASSEMBLY TEST SERVICES PTE·Filed 2003·Granted Apr 5, 2005·36 cites·17 claims
- 0883US6255143B1Flip chip thermally enhanced ball grid arrayST ASSEMBLY TEST SERVICES PTE·Filed 1999·Granted Jul 3, 2001·62 cites·11 claims
- 0982US6282812B1Multi air-knife box and method of useST ASSEMBLY TEST SERVICES PTE·Filed 1999·Granted Sep 4, 2001·48 cites·12 claims
- 1080US6825067B2Mold cap anchoring method for molded flex BGA packagesST ASSEMBLY TEST SERVICES PTE·Filed 2002·Granted Nov 30, 2004·26 cites·20 claims
- 1174US6403401B1Heat spreader hole pin 1 identifierST ASSEMBLY TEST SERVICES PTE·Filed 2000·Granted Jun 11, 2002·22 cites·7 claims
- 1272US6706563B2Heat spreader interconnect methodology for thermally enhanced PBGA packagesST ASSEMBLY TEST SERVICES PTE·Filed 2002·Granted Mar 16, 2004·18 cites·36 claims
- 1370US6355199B1Method of molding flexible circuit with molded stiffenerST ASSEMBLY TEST SERVICES PTE·Filed 1999·Granted Mar 12, 2002·35 cites·17 claims
- 1467US7446408B2Semiconductor package with heat sinkST ASSEMBLY TEST SERVICES PTE·Filed 2003·Granted Nov 4, 2008·12 cites·20 claims
- 1566US6271658B1Universal Docking SystemST ASSEMBLY TEST SERVICES PTE·Filed 1998·Granted Aug 7, 2001·30 cites·8 claims
- 1663US6660565B1Flip chip molded/exposed die process and package structureST ASSEMBLY TEST SERVICES PTE·Filed 2000·Granted Dec 9, 2003·10 cites·12 claims
- 1762US6284572B1Boat and assembly method for ball grid array packagesST ASSEMBLY TEST SERVICES PTE·Filed 2000·Granted Sep 4, 2001·12 cites·5 claims
- 1861US6791346B2Testing of BGA and other CSP packages using probing techniquesST ASSEMBLY TEST SERVICES PTE·Filed 2002·Granted Sep 14, 2004·8 cites·28 claims
- 1961US6168975B1Method of forming extended lead packageST ASSEMBLY TEST SERVICES PTE·Filed 1998·Granted Jan 2, 2001·24 cites·10 claims
- 2058US6404212B1Testing of BGA and other CSP packages using probing techniquesST ASSEMBLY TEST SERVICES PTE·Filed 1999·Granted Jun 11, 2002·17 cites·14 claims
- 2158US6300781B1Reliable method and apparatus for interfacing between a ball grid array handler and a ball grid array testing systemST ASSEMBLY TEST SERVICES PTE·Filed 1998·Granted Oct 9, 2001·23 cites·9 claims
- 2255US6818981B2Heat spreader interconnect for thermally enhanced PBGA packagesST ASSEMBLY TEST SERVICES PTE·Filed 2004·Granted Nov 16, 2004·6 cites·11 claims
- 2355US6774640B2Test coupon pattern design to control multilayer saw singulated plastic ball grid array substrate mis-registrationST ASSEMBLY TEST SERVICES PTE·Filed 2002·Granted Aug 10, 2004·6 cites·16 claims
- 2455US6372553B1Disposable mold runner gate for substrate based electronic packagesST ASSEMBLY TEST SERVICES PTE·Filed 1998·Granted Apr 16, 2002·18 cites·10 claims
- 2554US6359336B1Boat and assembly method for ball grid array packagesST ASSEMBLY TEST SERVICES PTE·Filed 2001·Granted Mar 19, 2002·7 cites·7 claims
- 2653US6828671B2Enhanced BGA grounded heatsinkST ASSEMBLY TEST SERVICES PTE·Filed 2002·Granted Dec 7, 2004·5 cites·22 claims
- 2751US6802445B2Cost effective substrate fabrication for flip-chip packagesST ASSEMBLY TEST SERVICES PTE·Filed 2002·Granted Oct 12, 2004·3 cites·39 claims
- 2850US7081668B2Flip chip molded/exposed die process and package structureST ASSEMBLY TEST SERVICES PTE·Filed 2003·Granted Jul 25, 2006·3 cites·13 claims
- 2948US6184047B1Contactor sleeve assembly for a pick and place semiconductor device handlerST ASSEMBLY TEST SERVICES PTE·Filed 1999·Granted Feb 6, 2001·18 cites·6 claims
- 3047US6426460B1Velcro strapping for semiconductor carrying traysST ASSEMBLY TEST SERVICES PTE·Filed 2000·Granted Jul 30, 2002·3 cites·9 claims
- 3146US6103550AMolded tape support for a molded circuit package prior to dicingST ASSEMBLY TEST SERVICES PTE·Filed 1998·Granted Aug 15, 2000·13 cites·18 claims
- 3243US6834658B2PBGA singulated substrate for model melamine cleaningST ASSEMBLY TEST SERVICES PTE·Filed 2002·Granted Dec 28, 2004·0 cites·7 claims
- 3338US6176066B1Hook and loop fastener strapping for semiconductor carrying traysST ASSEMBLY TEST SERVICES PTE·Filed 1999·Granted Jan 23, 2001·9 cites·28 claims
- 3438US2001002320A1Extended lead packageST ASSEMBLY TEST SERVICES PTE·Filed 2000·Application pending·0 cites
- 3536US7076861B2Multi-package conversion kit for a pick and place handlerST ASSEMBLY TEST SERVICES PTE·Filed 2003·Granted Jul 18, 2006·1 cites·15 claims
- 3635US6319418B1Zig-zagged plating bus linesST ASSEMBLY TEST SERVICES PTE·Filed 1999·Granted Nov 20, 2001·11 cites·9 claims
- 3734US6718608B2Multi-package conversion kit for a pick and place handlerST ASSEMBLY TEST SERVICES PTE·Filed 2002·Granted Apr 13, 2004·3 cites·1 claims
- 3833US6383303B1High volume fluid headST ASSEMBLY TEST SERVICES PTE·Filed 1999·Granted May 7, 2002·8 cites·12 claims
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