Assignee
SOZANSKY WAYNE A
0 granted patents·2 pending applications·0 citations·filing 2007–2010
Top patents by PatentIndex Score
2 records- 0141US2012168208A1System and method of forming a mechanical support for an electronic component attached to a circuit boardSOZANSKY WAYNE A·Filed 2010·Application pending·0 cites
- 0241US2008307643A1Method of assembly to achieve thermal bondline with minimal lead bendingSOZANSKY WAYNE A·Filed 2007·Application pending·0 cites
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