Assignee
SMITH JOHN M
0 granted patents·12 pending applications·0 citations·filing 2007–2007
Top patents by PatentIndex Score
12 records- 0143US2008202892A1Stacked process chambers for substrate vacuum processing toolSMITH JOHN M·Filed 2007·Application pending·0 cites
- 0243US2008206021A1Stacked process chambers for magnetic media processing toolSMITH JOHN M·Filed 2007·Application pending·0 cites
- 0343US2008206036A1Magnetic media processing tool with storage bays and multi-axis robot armsSMITH JOHN M·Filed 2007·Application pending·0 cites
- 0443US2008202419A1Gas manifold directly attached to substrate processing chamberSMITH JOHN M·Filed 2007·Application pending·0 cites
- 0543US2008202420A1Semiconductor substrate processing apparatus with horizontally clustered vertical stacksSMITH JOHN M·Filed 2007·Application pending·0 cites
- 0643US2008206020A1Flat-panel display processing tool with storage bays and multi-axis robot armsSMITH JOHN M·Filed 2007·Application pending·0 cites
- 0743US2008206022A1Mult-axis robot arms in substrate vacuum processing toolSMITH JOHN M·Filed 2007·Application pending·0 cites
- 0843US2008202410A1Multi-substrate size vacuum processing toolSMITH JOHN M·Filed 2007·Application pending·0 cites
- 0943US2008202687A1Stacked process chambers for flat-panel display processing toolSMITH JOHN M·Filed 2007·Application pending·0 cites
- 1043US2008202417A1Self-contained process modules for vacuum processing toolSMITH JOHN M·Filed 2007·Application pending·0 cites
- 1143US2008202686A1Self-contained process modules for magnetic media processing toolSMITH JOHN M·Filed 2007·Application pending·0 cites
- 1243US2008206023A1Semiconductor substrate processing apparatus with horizontally clustered vertical stacksSMITH JOHN M·Filed 2007·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when SMITH JOHN M files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →