Assignee
SILICONWARE PRECISON IND CO LT
TW·1 granted patent·1 pending application·44 citations·filing 2000–2005
Top patents by PatentIndex Score
2 records- 0183US6372551B1Method of manufacturing an image-sensor integrated circuit package without resin flash on lead frame and with increased wire bondabilitySILICONWARE PRECISON IND CO LT·Filed 2000·Granted Apr 16, 2002·44 cites·9 claims
- 0235US2006151862A1Lead-frame-based semiconductor package and lead frame thereofSILICONWARE PRECISON IND CO LT·Filed 2005·Application pending·0 cites
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