Assignee
SILICONWARE PREC IND CO L
TW·1 granted patent·2 pending applications·26 citations·filing 2000–2012
Technology mixH10W3
Top patents by PatentIndex Score
3 records- 0171US6294409B1Method of forming a constricted-mouth dimple structure on a leadframe die padSILICONWARE PREC IND CO L·Filed 2000·Granted Sep 25, 2001·26 cites·5 claims
- 0238US2013334684A1Substrate structure and package structureSILICONWARE PREC IND CO L·Filed 2012·Application pending·0 cites
- 0336US2014042638A1Semiconductor package and method of fabricating the sameSILICONWARE PREC IND CO L·Filed 2012·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when SILICONWARE PREC IND CO L files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →