Assignee
SILICON BOX PTE LTD
SG·0 granted patents·13 pending applications·0 citations·filing 2024–2025
Top patents by PatentIndex Score
13 records- 0164US2025219012A1Chip bonding apparatus for semiconductor packaging and semiconductor packaging method using the sameSILICON BOX PTE LTD·Filed 2024·Application pending·0 cites
- 0264US2025219003A1Redistribution layer structure, method of forming redistribution layer structure, semiconductor package device including redistribution layer structure, and method of manufacturing semiconductor package device including redistribution layer structureSILICON BOX PTE LTD·Filed 2024·Application pending·0 cites
- 0364US2025062216A1Method of manufacturing fan-out packaging device and fan-out packaging device manufactured therebySILICON BOX PTE LTD·Filed 2024·Application pending·0 cites
- 0464US2025062267A1Method of manufacturing fan-out packaging device and fan-out packaging device manufactured therebySILICON BOX PTE LTD·Filed 2024·Application pending·0 cites
- 0563US2025105160A1Interconnection module substrate for semiconductor package, semiconductor package device including the same, and manufacturing methods thereofSILICON BOX PTE LTD·Filed 2024·Application pending·0 cites
- 0662US2024347433A1Method of manufacturing fan-out packaging device and fan-out packaging device manufactured therebySILICON BOX PTE LTD·Filed 2024·Application pending·0 cites
- 0762US2025054867A1Fan-out package including bridge structure and method of manufacturing the sameSILICON BOX PTE LTD·Filed 2024·Application pending·0 cites
- 0861US2024363550A1Method of manufacturing fan-out packaging device and fan-out packaging device manufactured therebySILICON BOX PTE LTD·Filed 2024·Application pending·0 cites
- 0958US2025385221A1Semiconductor package device having fan-out structure and method of manufacturing the sameSILICON BOX PTE LTD·Filed 2025·Application pending·0 cites
- 1053US2025309038A1Semiconductor package device and method of manufacturing the sameSILICON BOX PTE LTD·Filed 2025·Application pending·0 cites
- 1152US2025294682A1Semiconductor package device and method of manufacturing the sameSILICON BOX PTE LTD·Filed 2025·Application pending·0 cites
- 1252US2025293171A1Semiconductor package device and method of manufacturing the sameSILICON BOX PTE LTD·Filed 2025·Application pending·0 cites
- 1352US2025309173A1Semiconductor package device and method of manufacturing the sameSILICON BOX PTE LTD·Filed 2025·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →