Assignee
SILEX MICROSYSTEMS AB
SE·14 granted patents·4 pending applications·133 citations·filing 2002–2023
Top patents by PatentIndex Score
18 records- 0192US7207227B2Pressure sensorSILEX MICROSYSTEMS AB·Filed 2005·Granted Apr 24, 2007·35 cites·24 claims
- 0285US9240373B2Semiconductor devices with close-packed via structures having in-plane routing and method of making sameSILEX MICROSYSTEMS AB·Filed 2013·Granted Jan 19, 2016·7 cites·14 claims
- 0383US9484293B2Semiconductor devices with close-packed via structures having in-plane routing and method of making sameSILEX MICROSYSTEMS AB·Filed 2015·Granted Nov 1, 2016·4 cites·6 claims
- 0481US7017420B2Miniaturized pressure sensorSILEX MICROSYSTEMS AB·Filed 2002·Granted Mar 28, 2006·31 cites·24 claims
- 0581US6973835B2Pressure sensorSILEX MICROSYSTEMS AB·Filed 2002·Granted Dec 13, 2005·25 cites·15 claims
- 0674US9514985B2Electroless metal through silicon viaSILEX MICROSYSTEMS AB·Filed 2013·Granted Dec 6, 2016·4 cites·6 claims
- 0773US9718674B2Thin capping for MEMS devicesSILEX MICROSYSTEMS AB·Filed 2014·Granted Aug 1, 2017·3 cites·10 claims
- 0873US9620390B2Method of making a semiconductor device having a functional cappingSILEX MICROSYSTEMS AB·Filed 2016·Granted Apr 11, 2017·2 cites·8 claims
- 0971US7172911B2Deflectable microstructure and method of manufacturing the same through bonding of wafersSILEX MICROSYSTEMS AB·Filed 2003·Granted Feb 6, 2007·20 cites·16 claims
- 1061US9607915B2Through substrate vias and deviceSILEX MICROSYSTEMS AB·Filed 2013·Granted Mar 28, 2017·2 cites·6 claims
- 1158US2026086115A1Microstructure inspection device and system and use of the sameSILEX MICROSYSTEMS AB·Filed 2023·Application pending·0 cites
- 1250US9448401B2Via structure and method thereofSILEX MICROSYSTEMS AB·Filed 2013·Granted Sep 20, 2016·0 cites·10 claims
- 1349US2010053922A1Micropackaging method and devicesSILEX MICROSYSTEMS AB·Filed 2008·Application pending·0 cites
- 1448US2009302414A1Trench isolation for reduced cross talkSILEX MICROSYSTEMS AB·Filed 2008·Application pending·0 cites
- 1545US9613863B2Method for forming electroless metal through viaSILEX MICROSYSTEMS AB·Filed 2016·Granted Apr 4, 2017·0 cites·20 claims
- 1643US9511999B2Thin film cappingSILEX MICROSYSTEMS AB·Filed 2012·Granted Dec 6, 2016·0 cites·12 claims
- 1743US9507142B2Precise definition of transducer electrodesSILEX MICROSYSTEMS AB·Filed 2013·Granted Nov 29, 2016·0 cites·20 claims
- 1840US2008308884A1Fabrication of Inlet and Outlet Connections for Microfluidic ChipsSILEX MICROSYSTEMS AB·Filed 2006·Application pending·0 cites
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