Assignee
SHINRYO CORP
JP·9 granted patents·3 pending applications·120 citations·filing 1986–2023
Top patents by PatentIndex Score
12 records- 0187US4780277AMethod and apparatus for subjecting gases to discharge treatmentSHINRYO CORP·Filed 1986·Granted Oct 25, 1988·63 cites·18 claims
- 0267US11359060B2Method of producing reclaimed carbon fiber bundles, reclaimed carbon fibers, or reclaimed milled carbon fibers, device for producing reclaimed carbon fiber bundles, method of producing carbon fiber reinforced resin, and reclaimed carbon fiber bundlesSHINRYO CORP·Filed 2019·Granted Jun 14, 2022·1 cites·20 claims
- 0365US7819987B2Antigen exposure chamber and method of cleaning and drying the sameSHINRYO CORP·Filed 2005·Granted Oct 26, 2010·2 cites·3 claims
- 0463US4718242AChemical heat pump utilizing clathrate formation reactionSHINRYO CORP·Filed 1986·Granted Jan 12, 1988·29 cites·22 claims
- 0559US10905635B2Gas-containing base material and manufacturing method thereforSHINRYO CORP·Filed 2018·Granted Feb 2, 2021·0 cites·4 claims
- 0658US4790939AMethod of improving SVI of mixed liquor in aeration tankSHINRYO CORP·Filed 1986·Granted Dec 13, 1988·24 cites·3 claims
- 0755US2024229241A9Method for improving adhesion of yttrium-based thin filmSHINRYO CORP·Filed 2023·Application pending·0 cites
- 0848US12285823B2Low melting-point bonding member, method for producing same, semiconductor electronic circuit, and method for mounting said semiconductor electronic circuitSHINRYO CORP·Filed 2021·Granted Apr 29, 2025·0 cites·9 claims
- 0945US11753714B2Washing method of semiconductor manufacturing device component having gas holesSHINRYO CORP·Filed 2022·Granted Sep 12, 2023·0 cites·20 claims
- 1044US8029729B2Antigen exposure chamber systemSHINRYO CORP·Filed 2005·Granted Oct 4, 2011·1 cites·8 claims
- 1137US2019335795A1Method for producing hydrogen gas-containing material and device for producing hydrogen gas-containing materialSHINRYO CORP·Filed 2018·Application pending·0 cites
- 1232US2022395935A1Sn-bi-in-based low melting-point joining member, production method therefor, semiconductor electronic circuit, and mounting method thereforSHINRYO CORP·Filed 2020·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →