Assignee
SHIMAZAKI YO
JP·2 granted patents·19 citations·filing 2006–2010
Top patents by PatentIndex Score
2 records- 0187US8739401B2Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit memberSHIMAZAKI YO·Filed 2010·Granted Jun 3, 2014·12 cites·7 claims
- 0275US8742554B2Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit memberSHIMAZAKI YO·Filed 2006·Granted Jun 3, 2014·7 cites·15 claims
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