Assignee
SHIBUYA KOUJIROU
JP·3 granted patents·7 citations·filing 2010–2012
Top patents by PatentIndex Score
3 records- 0164US8258617B2Semiconductor device, semiconductor package, interposer, semiconductor device manufacturing method and interposer manufacturing methodSHIBUYA KOUJIROU·Filed 2011·Granted Sep 4, 2012·3 cites·9 claims
- 0263US8243462B2Printed wiring board, semiconductor device, and method for manufacturing printed wiring boardSHIBUYA KOUJIROU·Filed 2010·Granted Aug 14, 2012·3 cites·9 claims
- 0352US8592968B2Semiconductor device, semiconductor package, interposer, semiconductor device manufacturing method and interposer manufacturing methodSHIBUYA KOUJIROU·Filed 2012·Granted Nov 26, 2013·1 cites·10 claims
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