Assignee
SHENZHEN STS MICROELECTRONICS CO LTD
CN·2 granted patents·10 pending applications·14 citations·filing 2005–2025
Top patents by PatentIndex Score
12 records- 0174US2026096072A1Intra-cooling devices for power modules, methods for manufacturing same, power modules and electrical systemsSHENZHEN STS MICROELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0270US7869549B2Automatic gain control system with self-adaptive attack and decay timeSHENZHEN STS MICROELECTRONICS CO LTD·Filed 2005·Granted Jan 11, 2011·9 cites·19 claims
- 0361US2026068666A1Dual-side cooling power modules and manufacturing methods thereof, and electrical systemsSHENZHEN STS MICROELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0461US2026096435A1Power modules, methods for manufacturing same, and electrical systemsSHENZHEN STS MICROELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0558US2024363501A1Semiconductor package, method of forming semiconductor package, and power moduleSHENZHEN STS MICROELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0658US2025226301A1Multilayer substrates, power modules, and electrical systemsSHENZHEN STS MICROELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0758US2025226273A1Multilayer substrates and methods for manufacturing same, power modules and methods for manufacturing same, and electrical systemsSHENZHEN STS MICROELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0856US2025220814A1Multilayer printed circuit board for interconnecting pin(s) and semiconductor die(s) and corresponding method for interconnectionSHENZHEN STS MICROELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0956US2025218954A1Package, manufacturing method thereof and electrical systemSHENZHEN STS MICROELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1053US2025006633A1Interconnect package, method of forming the same and power moduleSHENZHEN STS MICROELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1151US7928719B2Zero current detector for a DC-DC converterSHENZHEN STS MICROELECTRONICS CO LTD·Filed 2008·Granted Apr 19, 2011·5 cites·21 claims
- 1249US2024203843A1Semiconductor package, package forming method, and power supply moduleSHENZHEN STS MICROELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →