Assignee
SHENGYI TECHNOLOGY CO LTD
CN·63 granted patents·42 pending applications·22 citations·filing 2011–2023
Top patents by PatentIndex Score
105 records- 0187US10144824B2Halogen free resin composition and prepreg and laminated board prepared therefromSHENGYI TECHNOLOGY CO LTD·Filed 2014·Granted Dec 4, 2018·5 cites·19 claims
- 0287US9873789B2Halogen-free epoxy resin composition, prepreg and laminate using sameSHENGYI TECHNOLOGY CO LTD·Filed 2015·Granted Jan 23, 2018·3 cites·24 claims
- 0383US10240074B2Degradable and recyclable epoxy conductive adhesive as well as preparing, degrading and recycling methods thereforSHENGYI TECHNOLOGY CO LTD·Filed 2015·Granted Mar 26, 2019·3 cites·20 claims
- 0482US11930595B2Circuit material and circuit board containing the sameSHENGYI TECHNOLOGY CO LTD·Filed 2021·Granted Mar 12, 2024·2 cites·16 claims
- 0581US11053352B2Vinyl thermosetting resin composition, prepreg, laminate, and printed circuit boardSHENGYI TECHNOLOGY CO LTD·Filed 2019·Granted Jul 6, 2021·1 cites·17 claims
- 0681US10343383B2Thermosetting resin composition and prepreg and laminated board prepared therefromSHENGYI TECHNOLOGY CO LTD·Filed 2014·Granted Jul 9, 2019·2 cites·16 claims
- 0780US11377551B2Thermosetting resin composition, prepreg made therefrom, laminate clad with metal foil, and high-frequency circuit boardSHENGYI TECHNOLOGY CO LTD·Filed 2017·Granted Jul 5, 2022·1 cites·21 claims
- 0877US11661378B2Boron nitride agglomerate, thermosetting resin composition containing same, and use thereofSHENGYI TECHNOLOGY CO LTD·Filed 2018·Granted May 30, 2023·1 cites·19 claims
- 0974US12466937B2Resin composition and use thereofSHENGYI TECHNOLOGY CO LTD·Filed 2022·Granted Nov 11, 2025·0 cites·16 claims
- 1069US10544255B2Epoxy resin composition, prepreg and laminate prepared therefromSHENGYI TECHNOLOGY CO LTD·Filed 2016·Granted Jan 28, 2020·1 cites·18 claims
- 1169US10030143B2Ceramized silicone resin composition and pre-preg and laminate that use the compositionSHENGYI TECHNOLOGY CO LTD·Filed 2015·Granted Jul 24, 2018·1 cites·14 claims
- 1269US2024425730A1Resin composition and application thereofSHENGYI TECHNOLOGY CO LTD·Filed 2023·Application pending·0 cites
- 1365US2024228765A1Resin composition, insulating resin film and use thereofSHENGYI TECHNOLOGY CO LTD·Filed 2023·Application pending·0 cites
- 1464US12378386B2Resin composition and application thereofSHENGYI TECHNOLOGY CO LTD·Filed 2022·Granted Aug 5, 2025·0 cites·16 claims
- 1563US10308806B2Resin composition and uses thereof in high frequency circuit boardsSHENGYI TECHNOLOGY CO LTD·Filed 2014·Granted Jun 4, 2019·0 cites·20 claims
- 1662US2024218217A1Thermosetting resin composition and insulating adhesive film thereofSHENGYI TECHNOLOGY CO LTD·Filed 2023·Application pending·0 cites
- 1761US11732123B2Thermosetting resin composition, and prepreg, laminate and printed circuit board using sameSHENGYI TECHNOLOGY CO LTD·Filed 2020·Granted Aug 22, 2023·0 cites·19 claims
- 1861US11584851B2Resin composition, and prepreg and circuit material using the sameSHENGYI TECHNOLOGY CO LTD·Filed 2021·Granted Feb 21, 2023·0 cites·20 claims
- 1961US11261305B2Thermosetting resin composition, prepreg, laminate, and printed circuit boardSHENGYI TECHNOLOGY CO LTD·Filed 2019·Granted Mar 1, 2022·0 cites·17 claims
- 2061US9963590B2Halogen-free resin composition, and a prepreg and a laminate used for printed circuit using the sameSHENGYI TECHNOLOGY CO LTD·Filed 2014·Granted May 8, 2018·0 cites·19 claims
- 2161US9840620B2Halogen-free resin composition and uses thereofSHENGYI TECHNOLOGY CO LTD·Filed 2014·Granted Dec 12, 2017·0 cites·19 claims
- 2260US10645806B2Polyphenyl ether resin composition and use thereof in high-frequency circuit substrateSHENGYI TECHNOLOGY CO LTD·Filed 2016·Granted May 5, 2020·1 cites·19 claims
- 2360US10513608B2Process for preparing resin composition comprising benzoxazine, prepreg and laminate prepared therefromSHENGYI TECHNOLOGY CO LTD·Filed 2017·Granted Dec 24, 2019·0 cites·19 claims
- 2459US2023257583A1Resin composition and resin film, prepreg, laminated board, copper-clad board and printed circuit board comprising sameSHENGYI TECHNOLOGY CO LTD·Filed 2021·Application pending·0 cites
- 2558US12234325B2Resin composition, prepreg, laminate, metal foil-clad laminate, and printed circuit boardSHENGYI TECHNOLOGY CO LTD·Filed 2019·Granted Feb 25, 2025·0 cites·18 claims
- 2658US11975507B2Thermosetting resin composition, prepreg containing same, metal foil-clad laminate and printed circuit boardSHENGYI TECHNOLOGY CO LTD·Filed 2019·Granted May 7, 2024·0 cites·17 claims
- 2757US11945924B2Fluorine-containing resin composition, and resin vanish, fluorine-containing dielectric sheet, laminate, copper clad laminate and printed circuit board containing the sameSHENGYI TECHNOLOGY CO LTD·Filed 2020·Granted Apr 2, 2024·0 cites·14 claims
- 2857US10053547B2Thermosetting resin composition and uses thereofSHENGYI TECHNOLOGY CO LTD·Filed 2013·Granted Aug 21, 2018·0 cites·19 claims
- 2957US9771479B2Halogen-free resin composition and use thereofSHENGYI TECHNOLOGY CO LTD·Filed 2014·Granted Sep 26, 2017·0 cites·22 claims
- 3056US12234318B2Thermosetting epoxy resin composition and prepreg, laminated board and printed circuit board using thermosetting epoxy resin compositionSHENGYI TECHNOLOGY CO LTD·Filed 2020·Granted Feb 25, 2025·0 cites·16 claims
- 3156US11970591B2Resin composition, prepreg for printed circuit and metal-coated laminateSHENGYI TECHNOLOGY CO LTD·Filed 2018·Granted Apr 30, 2024·0 cites·19 claims
- 3256US10280343B2Adhesive resin composition, adhesive film, and flexible metal laminateSHENGYI TECHNOLOGY CO LTD·Filed 2015·Granted May 7, 2019·0 cites·19 claims
- 3355US10414136B2Halogen-free and phosphorus-free silicone resin composition, prepreg, laminate board, copper-clad plate using the same, and printed circuit boardSHENGYI TECHNOLOGY CO LTD·Filed 2015·Granted Sep 17, 2019·1 cites·19 claims
- 3455US10336875B2Halogen-free resin composition and prepreg and laminate prepared therefromSHENGYI TECHNOLOGY CO LTD·Filed 2014·Granted Jul 2, 2019·0 cites·19 claims
- 3555US2015183992A1Thermosetting resin composition and usage thereofSHENGYI TECHNOLOGY CO LTD·Filed 2014·Application pending·0 cites
- 3654US12122904B2Thermosetting resin composition and prepreg, laminate and printed circuit board using sameSHENGYI TECHNOLOGY CO LTD·Filed 2020·Granted Oct 22, 2024·0 cites·19 claims
- 3754US12104054B2Resin composition, prepreg containing same, laminate, and printed circuit boardSHENGYI TECHNOLOGY CO LTD·Filed 2019·Granted Oct 1, 2024·0 cites·10 claims
- 3854US2024010810A1Magnetic dielectric resin composition, and prepreg and copper clad laminate comprising sameSHENGYI TECHNOLOGY CO LTD·Filed 2020·Application pending·0 cites
- 3953US11319397B2Thermosetting resin composition, prepreg made therefrom, laminate clad with metal foil, and high-frequency circuit boardSHENGYI TECHNOLOGY CO LTD·Filed 2017·Granted May 3, 2022·0 cites·18 claims
- 4053US10513605B2Halogen-free epoxy resin composition, prepreg, laminate and printed circuit board containing the sameSHENGYI TECHNOLOGY CO LTD·Filed 2016·Granted Dec 24, 2019·0 cites·11 claims
- 4153US9611377B2Halogen-free thermosetting resin composition, and prepreg and laminate for printed circuits using the sameSHENGYI TECHNOLOGY CO LTD·Filed 2015·Granted Apr 4, 2017·0 cites·19 claims
- 4252US2023202126A1Low dielectric loss non-woven fabric, preparation method thereof and use thereofSHENGYI TECHNOLOGY CO LTD·Filed 2022·Application pending·0 cites
- 4351US11649351B2Resin composition for a metal substrate, and resin varnish and metal base copper-clad laminate comprising the sameSHENGYI TECHNOLOGY CO LTD·Filed 2020·Granted May 16, 2023·0 cites·9 claims
- 4451US10584222B2Resin composition and pre-preg and laminate using the compositionSHENGYI TECHNOLOGY CO LTD·Filed 2015·Granted Mar 10, 2020·0 cites·21 claims
- 4551US10400173B2Siloxane-modified cyclotriphosphazene halogen-free flame retardant, preparation process and use thereofSHENGYI TECHNOLOGY CO LTD·Filed 2017·Granted Sep 3, 2019·0 cites·22 claims
- 4651US10112368B2Flexible metal laminate and preparation method of the sameSHENGYI TECHNOLOGY CO LTD·Filed 2015·Granted Oct 30, 2018·0 cites·17 claims
- 4751US2016244471A1Phenoxycyclotriphosphazene active ester, halogen-free resin composition and uses thereofSHENGYI TECHNOLOGY CO LTD·Filed 2014·Application pending·0 cites
- 4850US11180617B2Method for preparing benzoxazine-containing resin composition, and prepreg and laminate made therefromSHENGYI TECHNOLOGY CO LTD·Filed 2017·Granted Nov 23, 2021·0 cites·19 claims
- 4950US10723875B2Halogen-free epoxy resin composition and a prepreg and a laminate using the sameSHENGYI TECHNOLOGY CO LTD·Filed 2017·Granted Jul 28, 2020·0 cites·20 claims
- 5050US2024084137A1Resin composition, resin adhesive film, and application thereofSHENGYI TECHNOLOGY CO LTD·Filed 2021·Application pending·0 cites
Showing the top 50 of 105 patent records by PatentIndex Score.
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