Assignee
SEMX CORP
US·2 granted patents·1 pending application·1 citations·filing 2001–2006
Top patents by PatentIndex Score
3 records- 0141US7946470B2Method for depositing solder material on an electronic component part using separatorsSEMX CORP·Filed 2006·Granted May 24, 2011·1 cites·21 claims
- 0229US2007152023A1Solder deposit method on electronic packages for post-connection processSEMX CORP·Filed 2005·Application pending·0 cites
- 0315US6648263B2Dynamic tensioning for wire-winding deviceSEMX CORP·Filed 2001·Granted Nov 18, 2003·0 cites·5 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →