Assignee
SEKIGUCHI JUNNOSUKE
JP·3 granted patents·3 pending applications·1 citations·filing 2009–2013
Top patents by PatentIndex Score
6 records- 0160US8089154B2Electronic component formed with barrier-seed layer on base materialSEKIGUCHI JUNNOSUKE·Filed 2009·Granted Jan 3, 2012·1 cites·5 claims
- 0250US8390123B2ULSI micro-interconnect member having ruthenium electroplating layer on barrier layerSEKIGUCHI JUNNOSUKE·Filed 2009·Granted Mar 5, 2013·0 cites·11 claims
- 0349US2014158546A1Electrolytic copper plating solution for filling for forming microwiring of copper for ulsiSEKIGUCHI JUNNOSUKE·Filed 2013·Application pending·0 cites
- 0447US8333834B2High-purity aqueous copper sulfonate solution and method of producing sameSEKIGUCHI JUNNOSUKE·Filed 2011·Granted Dec 18, 2012·0 cites·5 claims
- 0542US2012103820A1Electrolytic copper plating solution for filling for forming microwiring of copper for ulsiSEKIGUCHI JUNNOSUKE·Filed 2010·Application pending·0 cites
- 0638US2013139648A1Recovery Method for High Purity PlatinumSEKIGUCHI JUNNOSUKE·Filed 2011·Application pending·0 cites
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