Assignee
SCIENT COMPONENTS CORPORATION
US·10 granted patents·1 pending application·18 citations·filing 2016–2023
Top patents by PatentIndex Score
11 records- 0191US11744057B1Method and apparatus for a shielding structure of surface-mount devicesSCIENT COMPONENTS CORPORATION·Filed 2021·Granted Aug 29, 2023·3 cites·18 claims
- 0288US10861803B1Low cost millimeter wave integrated LTCC package and method of manufacturingSCIENT COMPONENTS CORPORATION·Filed 2018·Granted Dec 8, 2020·7 cites·14 claims
- 0380US11189902B1Method and apparatus for a miniature broadband RF power dividerSCIENT COMPONENTS CORPORATION·Filed 2020·Granted Nov 30, 2021·4 cites·14 claims
- 0472US11324111B1Apparatus for shielding of surface-mount devicesSCIENT COMPONENTS CORPORATION·Filed 2020·Granted May 3, 2022·1 cites·20 claims
- 0564US11638370B1Method and apparatus for a shielding structure of surface-mount LTCC devicesSCIENT COMPONENTS CORPORATION·Filed 2020·Granted Apr 25, 2023·0 cites·15 claims
- 0662US9949361B1Geometrically inverted ultra wide band microstrip balunSCIENT COMPONENTS CORPORATION·Filed 2016·Granted Apr 17, 2018·1 cites·19 claims
- 0761US10249463B1Magnetically operated electro-mechanical latching switchSCIENT COMPONENTS CORPORATION·Filed 2017·Granted Apr 2, 2019·2 cites·20 claims
- 0860US11430752B1Low cost millimiter wave integrated LTCC packageSCIENT COMPONENTS CORPORATION·Filed 2020·Granted Aug 30, 2022·0 cites·12 claims
- 0940US2024178541A1Method and apparatus for a coaxial high power rf combinerSCIENT COMPONENTS CORPORATION·Filed 2023·Application pending·0 cites
- 1039US11784146B1Method and apparatus for a ground wire bonding attachment in MMIC devicesSCIENT COMPONENTS CORPORATION·Filed 2021·Granted Oct 10, 2023·0 cites·20 claims
- 1130US12015382B1Method and apparatus for a linearized RF amplifier current sourceSCIENT COMPONENTS CORPORATION·Filed 2021·Granted Jun 18, 2024·0 cites·20 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →