Assignee
SCHUEHRER HOLGER
DE·1 granted patent·1 pending application·2 citations·filing 2005–2009
Top patents by PatentIndex Score
2 records- 0155US8097536B2Reducing metal voids in a metallization layer stack of a semiconductor device by providing a dielectric barrier layerSCHUEHRER HOLGER·Filed 2009·Granted Jan 17, 2012·2 cites·14 claims
- 0234US2006141775A1Method of forming electrical connections in a semiconductor structureSCHUEHRER HOLGER·Filed 2005·Application pending·0 cites
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