Assignee
SATO HIROAKI
JP·9 granted patents·2 pending applications·195 citations·filing 2003–2012
Top patents by PatentIndex Score
11 records- 0198US8618659B2Package-on-package assembly with wire bonds to encapsulation surfaceSATO HIROAKI·Filed 2012·Granted Dec 31, 2013·147 cites·38 claims
- 0297US8487421B2Microelectronic package with stacked microelectronic elements and method for manufacture thereofSATO HIROAKI·Filed 2011·Granted Jul 16, 2013·38 cites·36 claims
- 0375US8890304B2Fan-out microelectronic unit WLP having interconnects comprising a matrix of a high melting point, a low melting point and a polymer materialSATO HIROAKI·Filed 2011·Granted Nov 18, 2014·3 cites·21 claims
- 0470US8557424B2Secondary batterySATO HIROAKI·Filed 2006·Granted Oct 15, 2013·1 cites·19 claims
- 0565US8957520B2Microelectronic assembly comprising dielectric structures with different young modulus and having reduced mechanical stresses between the device terminals and external contactsSATO HIROAKI·Filed 2011·Granted Feb 17, 2015·2 cites·40 claims
- 0663US6946026B2Release agent for metallic moldSATO HIROAKI·Filed 2003·Granted Sep 20, 2005·3 cites·2 claims
- 0760US8525338B2Chip with sintered connections to packageSATO HIROAKI·Filed 2011·Granted Sep 3, 2013·1 cites·22 claims
- 0847US8277283B2Wafer polishing method and wafer produced therebySATO HIROAKI·Filed 2009·Granted Oct 2, 2012·0 cites·7 claims
- 0940US8432151B2Film-thickness measuring device using PLL circuitSATO HIROAKI·Filed 2008·Granted Apr 30, 2013·0 cites·3 claims
- 1038US2012286416A1Semiconductor chip package assembly and method for making sameSATO HIROAKI·Filed 2011·Application pending·0 cites
- 1133US2013249059A1Coating liquid for impurity diffusionSATO HIROAKI·Filed 2011·Application pending·0 cites
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