Assignee
SASAKI BEJI
JP·6 granted patents·7 pending applications·5 citations·filing 2000–2022
Top patents by PatentIndex Score
13 records- 0176US10980290B2GarmentSASAKI BEJI·Filed 2017·Granted Apr 20, 2021·2 cites·6 claims
- 0255US2024066830A1Substrate and productSASAKI BEJI·Filed 2022·Application pending·0 cites
- 0349US2013323455A1Metal foil with carrier and method for producing laminated substrate using sameSASAKI BEJI·Filed 2011·Application pending·0 cites
- 0448US7761315B1Customer-participating type production/supply system operating apparatusSASAKI BEJI·Filed 2000·Granted Jul 20, 2010·0 cites·26 claims
- 0547US2024090175A1Electronic device and productSASAKI BEJI·Filed 2022·Application pending·0 cites
- 0646US2024090138A1Prepreg with metal layer, method for manufacturing laminate, and method for manufacturing prepreg with metal layerSASAKI BEJI·Filed 2022·Application pending·0 cites
- 0742USD917128SClothing with collarSASAKI BEJI·Filed 2018·Granted Apr 27, 2021·3 cites·1 claims
- 0841US2014224459A1Exterior heat insultation cover panelSASAKI BEJI·Filed 2012·Application pending·0 cites
- 0940US2022178149A1Architectural wallSASAKI BEJI·Filed 2019·Application pending·0 cites
- 1039US11994351B2Cooling structural body, cooling system, heat generator and constructionSASAKI BEJI·Filed 2018·Granted May 28, 2024·0 cites·18 claims
- 1139USD945118SClothing with collarSASAKI BEJI·Filed 2021·Granted Mar 8, 2022·0 cites·1 claims
- 1239US10336034B2Carrier-attached metal foilSASAKI BEJI·Filed 2012·Granted Jul 2, 2019·0 cites·9 claims
- 1335US2020176341A1Electronic component mounting substrate and method of manufacturing the sameSASAKI BEJI·Filed 2018·Application pending·0 cites
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