Assignee
SAN-EI KAGAKU CO LTD
JP·3 granted patents·0 citations·filing 2012–2016
Top patents by PatentIndex Score
3 records- 0140US9732183B2Method for manufacturing hole-filling printed wiring board, curable resin composition and hole-filling printed wiring boardSAN-EI KAGAKU CO LTD·Filed 2016·Granted Aug 15, 2017·0 cites·7 claims
- 0239US9415469B2Resin composition for solder bump formation, solder bump formation method, and member having solder bumpsSAN-EI KAGAKU CO LTD·Filed 2014·Granted Aug 16, 2016·0 cites·3 claims
- 0337US9565754B2Solder-mounted board, production method therefor, and semiconductor deviceSAN-EI KAGAKU CO LTD·Filed 2012·Granted Feb 7, 2017·0 cites·9 claims
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