Assignee
SAMSUNG ELECTROMICS CO LTD
US·1 granted patent·1 pending application·23 citations·filing 1999–2022
Top patents by PatentIndex Score
2 records- 0164US6284591B1Formation method of interconnection in semiconductor deviceSAMSUNG ELECTROMICS CO LTD·Filed 1999·Granted Sep 4, 2001·23 cites·32 claims
- 0245US2024187941A1Method and apparatus for managing capability reporting of ue in wireless communication system supporting dual connectivitySAMSUNG ELECTROMICS CO LTD·Filed 2022·Application pending·0 cites
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